Semiconductor mounting device and method of manufacturing the same
View Patent ↗A semiconductor device of a high heat radiation type having improved reliability is disclosed. The semiconductor device comprises a semiconductor chip with plural bonding pads formed thereon, plural inner leads, plural bonding wires for connecting the bonding pads and the inner leads with each other, a heat spreader having a chip supporting surface for supporting the semiconductor chip and also having a rear surface exposed to the exterior, a chip bonding material for bonding the semiconductor chip and the heat spreader with each other, a resin body which seals the semiconductor chip with a sealing resin, and plural outer leads projecting to the exterior from the resin body. A protruding portion protruding upward from the chip supporting surface is formed around the chip on the chip supporting surface of the heat spreader, thereby relieving a thermal stress imposed on an end portion of the chip bonding material and improving the reliability of a QFP as the semiconductor device.
1. A semiconductor device comprising:
a semiconductor chip having a main surface and a rear surface on the side opposite to the main surface, with a semiconductor element and a plurality of banding pads being formed on the main surface;
a plurality of inner loads arranged along a periphery of the semiconductor chip;
a plurality of bonding wires which connect the plural bonding pads and the plural inner leads electrically with each other;
a chip mounting portion having a chip supporting surface for supporting the semiconductor chip end a rear surface located on the side opposite to the chip supporting surface and exposed to the exterior;
a chip bonding material disposed between the chip supporting surface and the rear surface of the semiconductor chip to bond the semiconductor chip and the chip mounting portion with each other;
a resin body which seals the semiconductor chip, the plural inner leads, the plural bonding wires, and the chip supporting surface of the chip mounting portion; and
a plurality of outer leads integral with the plural inner leads and projecting to the exterior from the resin body,
wherein a protruding portion protruding from the chip supporting surface is formed in a frame shape along the periphery of the semiconductor chip on the chip supporting surface of the chip mounting portion.
2. A semiconductor device according to claim 1 , wherein the height of the protruding portion in the chip mounting portion from the chip supporting surface is larger than the thickness of the chip bonding material.
3. A semiconductor device according to claim 1 , wherein the distance of the protruding portion in the chip mounting portion from an end portion of the semiconductor chip is shorter than the distance from the protruding portion to an end portion of the chip mounting portion.
4. A semiconductor device according to claim 1 , wherein the protruding portion has substantially parallel inner wall and outer wall surfaces.
5. A semiconductor device comprising:
a semiconductor chip having a main surface and a rear surface on the side opposite to the main surface, with a semiconductor element and a plurality of bonding pads being formed on the main surface;
a plurality of inner leads arranged along a periphery of the semiconductor chip;
a plurality of bonding wires as connecting members which connect the plural bonding pads and the plural inner leads electrically with each other;
a chip mounting portion having a chip supporting surface for supporting the semiconductor chip and a rear surface located on the side opposite to the chip supporting surface and exposed to tho exterior;
a chip bonding material disposed between the chip supporting surface and the rear surface of the semiconductor chip to bond the semiconductor chip and the chip mounting portion with each other;
a resin body which seals the semiconductor chip, the plural inner leads, and the plural bonding wires, the resin body having a chip side sealing portion disposed sideways of the semiconductor chip; and
a plurality of outer leads integral respectively with the plural inner leads and projecting to the exterior from the resin body;
wherein a protruding portion protruding from the chip supporting surface is formed in a frame shape along the periphery of the semiconductor chip on the chip supporting surface of the chip mounting portion.
6. A semiconductor device according to claim 5 , wherein the height of the protruding portion in the chip mounting portion from the chip supporting surface is larger than the thickness of the chip bonding material.
7. A semiconductor device according to claim 5 , wherein the distance of the protruding portion in the chip mounting portion from an end portion of the semiconductor chip is shorter than the distance from the protruding portion to an end portion of the chip mounting portion.
8. A semiconductor device according to claim 5 , wherein the protruding portion in the chip
mounting portion it formed from the outside of the chip side sealing portion up to an end portion of the chip mounting portion.
9. A semiconductor device according to claim 5 , wherein the chip mounting portion is formed of copper or copper alloy.
10. A semiconductor device according to claim 5 , wherein the protruding portion has substantially parallel inner wall and outer wall surfaces.