Printhead having a thin pre-fired piezoelectric layer
View Patent ↗Ink jet printheads and printhead components are described. One printhead includes a flow path and a piezoelectric actuator. The flow path includes a pumping region and the piezoelectric actuator is associated with the pumping region. The actuator has a pre-fired piezoelectric layer with a thickness of about 50 microns or less. A bonding layer fixes the pre-fired piezoelectric layer relative to the flow path.
1. A printhead comprising:
a flow path including a pumping region and,
a multi-layer piezoelectric actuator associated with the pumping region of the flow path, said actuator having a single pre-fired piezoelectric layer with a thickness of about 50 microns or less, wherein said pre-fired piezoelectric layer is formed by a process including bonding to a support body a pre-fired piezoelectric material having a thickness of 200 microns or more and grinding said body to a reduced thickness of about 50 microns or less, an actuator membrane formed of a single silicon layer having a thickness of about 20 microns or less and a bonding layer that fixes the pre-fired piezoelectric layer to the actuator membrane.
2. The printhead of claim 1 wherein the piezoelectric layer is about 25 micron or less.
3. The printhead of claim 1 wherein the piezoelectric layer has a surface with an R a of about 0.05 micron or less.
4. The printhead of claim 1 wherein the piezoelectric layer is a substantially planar body of piezoelectric material.
5. The printhead of claim 1 wherein the pumping region is formed of silicon.
6. The printhead of claim 5 wherein the flow path includes a nozzle opening and the nozzle opening is in silicon.
7. The printhead of claim 5 wherein the flow path is defined in a body that is a wafer segment and the piezoelectric actuator is attached to a first face of the body and the flow path includes a nozzle on a second opposing face of the body.
8. The printhead of claim 1 , wherein:
the actuator membrane is between the piezoelectric layer and the flow path, and
the bonding layer is between the piezoelectric layer and the membrane.
9. The printhead of claim 1 , wherein:
the piezoelectric layer has a metal layer formed thereon, and
the bonding layer is between the metal layer and the flow path.
10. The printhead of claim 9 , wherein the piezoelectric layer is exposed to the flow path.
11. The printhead of claim 1 , wherein:
the piezoelectric layer has a metal layer formed thereon, and
the bonding layer is between the metal layer and the membrane.
12. The printhead of claim 1 , wherein the actuator includes a metal layer supported by the piezoelectric layer on a side opposite to the bonding layer.
13. The printhead of claim 1 , wherein the bonding layer includes a eutectic bond.
14. The printhead of claim 1 , wherein the pumping region includes silicon.
15. The printhead of claim 1 , wherein the printhead includes multiple flow paths with associated actuators.
16. The printhead of claim 1 , wherein the bonding layer includes amorphous silicon.
17. The printhead of claim 1 , wherein the bonding layer includes BCB.
18. The printhead of claim 1 , wherein the pre-fired piezoelectric layer has a d 31 of about 200 or more.
19. The printhead of claim 1 , wherein the density of the piezoelectric layer is about 7.5 g/cm or more.
20. The printhead of claim 1 , wherein the printhead includes a plurality of pumping regions, associated actuators, and associated ejection nozzles for ejecting fluid from the printhead, the ejection nozzles having a diameter of about 50 micron or less.
21. The printhead of claim 20 , wherein the plurality of pumping regions are defined in a common body.
22. The printhead of claim 21 , wherein the common body is a wafer of silicon or SOI and said pumping regions are defined on a face of said wafer.
23. The printhead of claim 20 , wherein the plurality of ejection nozzles are defined in a common body.
24. The printhead of claim 21 or 23 , wherein the common body is an etchable material by deep reactive ion etching.
25. The printhead of claim 24 , wherein the etchable material is silicon.
26. The printhead of claim 20 , wherein the common body is a wafer of silicon or SOI and the nozzles are defined on a face of said wafer.
27. The printhead of claim 1 wherein the pumping region includes a well defined on a first side of a silicon substrate and said actuator covers the well, and said flow path includes a conduit to a second side of the substrate for directing ink to an ejection orifice.