IP Library › Granted Patent US 6,708,873
Granted Patent Utility
US 6,708,873 · Confirmation No. 8377

APPARATUS AND METHOD FOR FILLING HIGH ASPECT RATIO VIA HOLES IN ELECTRONIC SUBSTRATES

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2002-07-08 SPEC Specification 20 View
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Quick Facts
Patent No.
US 6,708,873
App. No.
10/191,378
Filed
2002-07-08
Granted
2004-03-23
Pub. No.
US20020175438A1
Art Unit
1725
PTA
0 days