IP Library Granted Patent US 7,041,229
Granted Patent B2
US 7,041,229 · App. 10/194,542 · Granted May 9, 2006

Patterned product and its manufacturing method

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Quick Facts
Patent No.
US 7,041,229
App. No.
10/194,542
Granted
May 9, 2006
Kind
B2
Abstract

To provide a manufacturing method for simultaneously forming machined patterns different in dept in a small number of steps and a machined pattern having a U-shaped sectional form in which depths and widths are smoothly changed. Mask patterns 62 respectively having a semicircular sectional form and mask patterns 65 respectively having a V-shaped sectional form are formed at different opening widths 63 and 64 respectively to perform sandblasting by using the mask patterns 62 and 65 as masks. Though a deep groove is formed between the semicircular-sectional-form mask patterns 62, a shallow groove is formed between the V-shaped-sectional-form mask patterns 65.

Claims (18)

1. A patterned-product manufacturing method comprising the step of:

(1) forming a workpiece on a substrate;

(2) forming a mask pattern on the workpiece; and

(3) machining the workpiece by a polishing method using a viscous flow including an abrasive by using the mask pattern as a mask, wherein

at least machined patterns having different depths are simultaneously formed by the mask pattern of only one layer formed in the step (2).

2. The patterned-product manufacturing method according to claim 1 , wherein the mask pattern has at least two different pattern intervals.

3. The patterned-product manufacturing method according to claim 2 , wherein an upper face of at least a part of a region of the mask pattern is not flat.

4. The pattern-product manufacturing method according to claim 1 wherein the mask pattern has a first sectional form and a second sectional form which is different from the first sectional form.

5. The pattern-product manufacturing method according to claim 4 , wherein a maximum-influential distance of a stripping flow of the first sectional form is longer than that of the second sectional form.

6. The patterned-product manufacturing method according to claim 5 , wherein the sectional form of the upper face of the mask pattern is any one of almost flat, U-shaped, V-shaped, W-shaped, semicircular, and triangular.

7. The patterned-product manufacturing method according to claim 2 , wherein at least one of the intervals of the mask pattern is shorter than a distance that is twice as long as a maximum-influential distance of a stripping flow generated when machining the workpiece at an end of the mask pattern defining the at least one of the intervals.

8. The patterned-product manufacturing method according to any one of claims 1 to 6 , wherein the interval between two faced ridges of the above two adjacent mask patterns changes along a ridge.

9. The patterned-product manufacturing method according to any one of claim 1 to 6 , wherein the polishing method using the viscous flow is a sandblasting method.

10. The patterned-product manufacturing method according to any one of claims 1 to 6 , wherein the mask pattern is formed by a photosensitive material.

11. The patterned-product manufacturing method according to claim 10 , wherein the photosensitive material is a dry film resist.

12. The patterned-product manufacturing method according to claim 10 , wherein an exposure mask for forming the mask pattern has a half-tone exposure region and the light transmission quantity of the half-tone exposure region changes correspondingly to a necessary film thickness of the region of a mask pattern corresponding to the region of the exposure mask.

13. The patterned-product manufacturing method according to claim 12 , wherein a slit is formed on an opaque film of the half-tone region of the exposure mask.

14. The patterned-product manufacturing method according to claim 13 , wherein the light transmission quantity of the half-tone exposure region is decided in accordance with the width and/or density of the slit.

Assignments (6)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 15, 2009
From: PIONEER CORPORATION (FORMERLY CALLED PIONEER ELECTRONIC CORPORATION)
To: PANASONIC CORPORATION
Reel/Frame 023234/0173 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 29, 2005
From: PIONEER PLASMA DISPLAY CORPORATION
To: PIONEER CORPORATION
Reel/Frame 016593/0127 →
CHANGE OF NAME Recorded Dec 17, 2004
From: NEC PLASMA DISPLAY CORPORATION
To: PIONEER PLASMA DISPLAY CORPORATION
Reel/Frame 015478/0218 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 15, 2004
From: NEC CORPORATION
To: NEC PLASMA DISPLAY CORPORATION
Reel/Frame 015460/0617 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 8, 2003
From: KAWANISHI, YOSHITAKA
To: NEC CORPORATION
Reel/Frame 013640/0190 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 4, 2002
From: KAWANISHI, YOSHITAKA
To: NEC CORPORATION
Reel/Frame 013260/0557 →