IP Library Granted Patent US 6,882,506
Granted Patent B2
US 6,882,506 · App. 10/197,095 · Granted Apr 19, 2005

Head suspension having reduced heat deformation

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Quick Facts
Patent No.
US 6,882,506
App. No.
10/197,095
Granted
Apr 19, 2005
Kind
B2
Abstract

A suspension is made of a suspension body of a stainless plate, a resin protective layer on one surface of the suspension body, a circuit pattern including read wiring and write wiring on the protective layer, and a metal layer provided on the other surface of the suspension body. In this arrangement, heat deformation of the suspension is alleviated when a write current is applied.

Claims (6)

1. A suspension structure, comprising:

a suspension body;

a circuit pattern formed on one surface of the suspension body; and

a metal layer provided on the other surface of the suspension body,

the suspension body having a thickness greater than a thickness of the metal layer, and wherein the suspension body has an opening, and a second metal layer is inserted in said opening and in contact with the metal layer.

2. The suspension structure according to claim 1 , wherein said metal layer is applied to substantially all of said other surface of the suspension body.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 26, 2009
From: FUJITSU LIMITED
To: TOSHIBA STORAGE DEVICE CORPORATION
Reel/Frame 023861/0881 →