Semiconductor integrated circuit device and method of manufacturing the same
View Patent ↗A semiconductor integrated circuit device includes a cell transistor; a bit line provided above the cell transistor; a magnetoresistive element provided above the bit line, a first end portion of the magnetoresistive element being electrically connected to the bit line; an intracell local interconnection provided above the magnetoresistive element, the intracell local interconnection coupling one of source and drain regions of the cell transistor to a second end portion of the magnetoresistive element; and a write word line provided above the intracell local interconnection, a portion between the write word line and the intracell local interconnection being filled with an insulator alone.
1. A semiconductor integrated circuit device comprising:
a cell transistor;
a bit line provided above the cell transistor;
a magnetoresistive element provided above the bit line, a first end portion of the magnetoresistive element being electrically connected to the bit line;
an intracell local interconnection provided above the magnetoresistive element, the intracell local interconnection coupling one of source and drain regions of the cell transistor to a second end portion of the magnetoresistive element; and
a write word line provided above the intracell local interconnection, a portion between the write word line and the intracell local interconnection being filled with an insulator alone.
2. The device according to claim 1 , further comprising:
a first via electrically connected to the intracell local interconnection and the one of source and drain regions of the cell transistor, the first via provided from a same conductive layer as that of the bit line.
3. The device according to claim 2 , further comprising:
a source line electrically connected to the other of source and drain regions of the cell transistor; and
a second via electrically connected to the first via and the one of source and drain regions of the cell transistor, the second via provided from a same conductive layer as that of the source line.
4. The device according to claim 1 , further comprising:
a first yoke material that coven side surfaces of the write word line and extends below the write word line.
5. The device according to claim 4 , wherein the first yoke material covers an upper surface of the write word line.
6. The device according to claim 5 , wherein of the first yoke material, a portion coven the side surfaces of the write word line and extends below the word line is formed from an insulating material, and a portion that covers the upper surface of the write word line is formed from a conductive material.
7. The device according to claim 4 , wherein the first yoke material is a conductor.
8. The device according to claim 7 , further comprising:
an insulation layer provided between the first yoke material and the intracell local interconnection.
9. The device according to claim 8 , wherein a width of the intracell local interconnection is equal to a width of the write word line.
10. The device according to claim 4 , wherein the first yoke material is an insulator.
11. The device according to claim 10 , wherein the first yoke material is in contact with the intracell local interconnection.
12. The device according to claim 10 , wherein a width of the intracell local interconnection is equal to a width of the write word line.
13. The device according to claim 4 , further comprising:
a second yoke material that covers bottom and side surfaces of the bit line.
14. The device according to claim 13 , wherein the second yoke material is not in contact with the first yoke material.
15. The device according to claim 14 , further comprising:
a dielectric interlayer provided between the intracell local interconnection and the bit line, the dielectric interlayer having a portion sandwiched between the second yoke material and the first yoke material.
16. The device according to claim 15 , wherein the dielectric interlayer includes a stopper layer containing an insulating material different from the dielectric interlayer, the stopper layer located on the bit line and sandwiched between the second yoke material and the first yoke material.
17. The device according to claim 1 , wherein a bottom surface of the magnetoresistive element and an upper surface of the bit line are on the same level.
18. The device according to claim 1 , wherein the magnetoresistive element is a tunneling magnetoresistive element.
19. A semiconductor integrated circuit device comprising:
a cell transistor;
a bit line provided above the cell transistor;
a magnetoresistive element provided above the bit line, a first end portion of the magnetoresistive element being electrically connected to the bit line;
an intracell local interconnection provided above the magnetoresistive element, the intracell local interconnection coupling one of source and drain regions of the cell transistor to a second end portion of the magnetoresistive element; and
a write word line provided above the intracell local interconnection, the write word line entirely covering a top surface of the intracell local interconnection.