IP Library Granted Patent US 6,917,061
Granted Patent B2
US 6,917,061 · App. 10/201,760 · Granted Jul 12, 2005

AlGaAs or InGaP low turn-on voltage GaAs-based heterojunction bipolar transistor

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Quick Facts
Patent No.
US 6,917,061
App. No.
10/201,760
Granted
Jul 12, 2005
Kind
B2
Abstract

A heterojunction bipolar transistor is provided that has a reduced turn-on voltage threshold. A base spacer layer is provided and alternately an emitter layer is provided that has a lowered energy gap. The lowered energy gap of the base spacer or the emitter spacer allow the heterojunction bipolar transistor to realize a lower turn-on voltage threshold. The thickness of the emitter layer if utilized is kept to a minimum to reduce the associated space charge recombination current in the heterojunction bipolar transistor.

Claims (34)

1. A compound semiconductor device, comprising:

a first GaAs layer:

a second GaAs layer formed on the first GaAs layer;

a third p-type GaAs layer formed on the second GaAs layer;

a p-type In y Ga 1−y As layer (0.0≦Y≦0.3) formed on the third GaAs layer;

an n type In x Ga 1−x P layer (0.5<x<0.7) formed on the In y Ga 1−y As layer;

an n type In 0.51 Ga 0.49 P layer formed on the n type In x Ga 1−x P layer;

an n type GaAs layer formed on the n type In 0.51 Ga 0.49 P layer; and

an n type In x Ga 1−x As layer (0.0<x<0.6) formed on the n type GaAs layer.

2. A compound semiconductor device, comprising:

a first GaAs layer:

a second GaAs layer formed on the first GaAs layer;

a third p-type GaAs layer formed on the second GaAs layer;

a p-type In y Ga 1−y As layer (0.0≦y≦0.3) formed on the third GaAs layer;

an n type In y Al x Ga 1−x ) 1−y As layer (0.0<y<0.15) (0.0<x<0.3) formed on the In y Ga 1−y As layer;

an n type Al 0.3 Ga 0.7 As layer formed on the n type In y (Al x Ga 1−x ) 1−y As layer;

an n type Al x Ga 1−x As (0.0<x <0.3) layer formed on the n type Al 0.3 Ga 0.7 As layer;

an n type GaAs layer formed on the n type Al x Ga 1−x As layer; and

an n type In x Ga 1−x As layer (0.0<x<0.6) formed on the n type GaAs layer.

3. A compound semiconductor device, comprising:

a first GaAs layer:

a second GaAs layer formed on the first GaAs layer;

a p-type GaAs layer formed on the second GaAs layer;

an p-type GaAs 1−x Sb x layer (0.0≦x≦0.3) formed on the third GaAs layer;

an n type In y (Al x Ga 1−x ) 1−y As layer (0.0<y<0.3) (0.0<x<0.3) formed on the GaAs 1−x Sb x layer;

an n type Al 0.3 Ga 0.7 As layer formed on the n type In y (Al x Ga 1−x ) 1−y As layer;

an n type Al x Ga 1−x As (0.0<x<0.5) layer formed on the n type Al 0.3 Ga 0.7 As layer;

an n type GaAs layer formed on the n type Al x Ga 1−x As layer; and

an n type In x Ga 1−x As layer (0.0<x<0.6) formed on the n type GaAs layer.

4. A heterojunction bipolar transistor, comprising,

a contact having at least one layer of a first material;

an emitter having an emitter spacer of an n type In x Ga 1−x P (0.5<x<0.7) material;

a base having a base spacer of an GaAs 1−x Sb x (0.0≦x≦0.3) material; and

a collector having at least one layer of said first material.

Assignments (2)
RELEASE OF SECURITY INTEREST Recorded Aug 19, 2016
From: PNC BANK NATIONAL ASSOCIATION
To: MICROLINK DEVICES, INC.
Reel/Frame 039482/0650 →
SECURITY AGREEMENT Recorded Feb 23, 2012
From: MICROLINK DEVICES, INC.
To: PNC BANK, NATIONAL ASSOCIATION
Reel/Frame 027853/0736 →