Encapsulation for an electrical component and method for producing the same
View Patent ↗Encapsulating a component structure includes applying a fluid, light-sensitive first reactive resin layer to a surface of a component substrate containing the component structure, exposing and developing the first reactive resin layer so as to form a frame structure that encloses the component structure, covering the frame structure with an auxiliary foil, applying a second reactive resin layer to a surface of the auxiliary foil so as to form ceiling structures on the surface of the auxiliary foil, at least one of the ceiling structures making a seal with the frame structure, and removing the auxiliary foil in areas between ceiling structures.
1. A method of encapsulating a component structure, comprising the following steps performed in order:
applying a first reactive resin layer to a surface of a component substrate containing the component structure, the first reactive resin layer comprising a light-sensitive fluid;
exposing and developing the first reactive resin layer so as to form a frame structure that encloses the component structure;
covering the frame structure with an auxiliary foil;
applying a second reactive resin layer comprising a fluid to a surface of the auxiliary foil so as to form ceiling structures on the surface of the auxiliary foil, at least one of the ceiling structures making a seal with the frame structure;
causing the second reactive resin layer to harden;
removing the auxiliary foil only in areas between ceiling structures.
2. A method according to claim 1 , wherein applying the second reactive resin layer comprises:
spin-coating the second reactive resin layer onto an entire surface of the auxiliary foil, the second reactive resin layer comprising a light-sensitive fluid; and
exposing and developing the second reactive resin layer so as to form the ceiling structures, at least one of the ceiling structures forming a cavity with the frame structure.
3. A method according to claim 2 , wherein exposing at least one of the first reactive resin layer and the second reactive resin layer is performed using a laser.
4. A method according to claim 2 , wherein developing at least one of exposed first and second reactive resin layers is performed using a fluid developer.
5. A method according to claim 1 , wherein the second reactive resin layer is applied in a structured manner to the surface of the auxiliary foil by directly printing ceiling structures onto the surface of the auxiliary foil.
6. A method according to claim 1 , wherein the ceiling structures are formed and then cured using one of a screen and stencil printing process.
7. A method according to claim 1 , wherein the auxiliary foil comprises thin plastic.
8. A method according to claim 1 , further comprising fixing the auxiliary foil to the frame structure using at least one of an adhering process and a fusing process.
9. A method according to claim 1 , wherein removing is performed using an incineration treatment and plasma.
10. A method according to claim 1 , wherein removing is performed using a solvent.
11. A method according to claim 1 , further comprising forming damping structures on the component substrate during exposing and developing.
12. A method according to claim 1 , wherein the auxiliary foil comprises at least one of polyamide, PET and polycarbonate and has a thickness of 0.5 to 5 μm.
13. A method according to claim 1 , wherein the first and second reactive resin layers comprise a UV-cured epoxy resin.
14. A method of encapsulating a wafer, comprising the following steps performed in order:
applying a first reactive resin layer to a surface of the wafer, the first reactive resin layer comprising a light-sensitive fluid;
exposing and developing the first reactive resin layer so as to form a frame structure that encloses the wafer;
covering the frame structure with an auxiliary foil, the auxiliary foil comprising a thin plastic;
applying a second reactive resin layer comprising a fluid to a surface of the auxiliary foil so as to form ceiling structures on the surface of the auxiliary foil, at least one of the ceiling structures making a seal with the frame structure;
hardening the second reactive resin layer; and
removing the auxiliary foil only in areas between ceiling structures.
15. A method according to claim 14 , wherein applying the second reactive resin layer comprises:
spin-coating the second reactive resin layer onto an entire surface of the auxiliary foil, the second reactive resin layer comprising a light-sensitive fluid; and
exposing and developing the second reactive resin layer so as to form the ceiling structures, at least one of the ceiling structures forming a cavity with the frame structure.
16. A method according to claim 14 , wherein the ceiling structures are formed and then cured using one of a screen and stencil printing process.