High strength vacuum deposited nitinol alloy films and method of making same
View Patent ↗A vacuum deposition method for fabricating high-strength nitinol films by sputter depositing nickel and titanium from a heated sputtering target, and controlling the sputter deposition process parameters in order to create high-strength nitinol films that exhibit shape memory and/or superelastic properties without the need for precipitation annealing to attenuate the transition conditions of the deposited material. A vacuum deposited nitinol film having high-strength properties equal to or better than wrought nitinol films and which are characterized by having non-columnar crystal grain structures.
1. A tubular nitinol film comprising a substantially non-columnar crystalline microstructure and substantially free of precipitates, wherein the nitinol film has an ultimate strength greater than about 1250 MPa and a maximum strain greater than about 12%.
2. The nitinol film of claim 1 , wherein the nitinol film has a transition temperature A p of between about −20° C. and −60° C.
3. The nitinol film of claim 1 made by a method using a vacuum sputter deposition apparatus having a magnetron, a cathode, a cooling device thermally coupled to the cathode and a deposition chamber capable of being selectively isolated from the atmosphere, the method comprising the steps of:
a. disposing at least one target selected from the group consisting of nickel, titanium and nickel-titanium alloy in the deposition chamber;
b. disposing a substrate that is spatially separated from the target in the deposition chamber;
c. supplying a working gas selected to the deposition chamber;
d. sputter depositing material from the at least one target to form a substantially non-columnar crystalline film under conditions where the mean free paths of the sputtered particles is greater than about half the distance between the target and the substrate; and
e. removing the deposited nitinol film from the substrate.
4. The nitinol film of claim 1 made by a method, comprising the steps of:
a. providing a vacuum deposition apparatus;
b. providing at least one target selected from the group consisting of nickel, titanium, and nickel-titanium alloy;
c. providing and heating a substrate before and during a deposition run;
d. vacuum depositing nitinol metal from the at least one target onto the deposition substrate to form a substantially non-columnar crystalline film during vacuum deposition;
e. controlling at least one vacuum deposition processing parameter selected from the group of isothermally heating the deposition target, controlling the base vacuum pressure, deoxygenating the working gas, controlling the deposition pressure, controlling surface roughness of the substrate, controlling the composition of the substrate, applying a negative bias voltage to the substrate and controlling the throw distance between the deposition substrate and the deposition target; and
f. removing the deposited nitinol film from the deposition substrate.