IP Library › Granted Patent US 6,830,990
Granted Patent Utility
US 6,830,990 · Confirmation No. 6270

METHOD AND APPARATUS FOR DICING RELEASED MEMS WAFERS

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2008-03-13 C.AD Change of Address 1 View
2008-03-13 N417 Electronic Filing System Acknowledgment Receipt 2 View
2004-04-13 IFEE Issue Fee Payment (PTO-85B) 3 View
2004-04-13 C.AD Change of Address 1 View
2004-03-01 CFILE Request for Corrected Filing Receipt 2 View
2002-12-26 TRNA Transmittal of New Application 3 View
2002-12-26 DRW Drawings-only black and white line drawings 8 View
2002-08-07 TRNA Transmittal of New Application 3 View
2002-08-07 SPEC Specification 10 View
2002-08-07 CLM Claims 2 View
2002-08-07 ABST Abstract 1 View
2002-08-07 DRW Drawings-only black and white line drawings 8 View
2002-08-07 OATH Oath or Declaration filed 3 View
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Quick Facts
Patent No.
US 6,830,990
App. No.
10/214,918
Filed
2002-08-07
Granted
2004-12-14
Art Unit
2824
PTA
0 days