IP Library Granted Patent US 7,046,868
Granted Patent B2
US 7,046,868 · App. 10/216,858 · Granted May 16, 2006

Optical waveguide transmitter-receiver module

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Quick Facts
Patent No.
US 7,046,868
App. No.
10/216,858
Granted
May 16, 2006
Kind
B2
Abstract

A planar-mounted optical waveguide transmitter-receiver module has a plurality of separated silicon substrates and a PLC substrate hybrid-integrated. In this module, electrical crosstalk between the light emitting element side and photo-receiving element side is reduced, and an adhesion area between substrates is decreased. In this module, a first silicon substrate, on which are mounted a light emitting element and photo-receiving element, is positioned opposing a second silicon substrate, in which is formed a V groove, in which an optical fiber is to be inserted and fixed in place with resin or by other means. On joining surfaces of the first silicon substrate and joining surfaces of the second silicon substrate are positioned and fixed in place joining surfaces on the back face of the optical waveguide (PLC) substrate, in which is formed an optical waveguide. By this means, the light emitting element, the photo-receiving element, and the optical fiber inserted into the V groove are optically aligned with and simultaneously optically coupled with the optical waveguide of the PLC substrate.

Claims (29)

1. An optical waveguide transmitter-receiver module, comprising:

a first substrate having a first positioning mark on a top surface side thereof;

a second substrate having a second positioning mark on a top surface side thereof;

a third substrate having an optical waveguide formed therein, optical waveguide entry and exit end faces and a third positioning mark on a bottom surface side thereof;

wherein protruding portions, which are formed on both top surfaces of said first and second substrates or a bottom surface of said third substrate, have a flat top or bottom surface, respectively, for bonding with said bottom surface of said third substrate or said both top surfaces of said first and second substrates;

said both top surfaces of said first and second substrates or said bottom surface of said third substrate is flat for bonding with said flat top or bottom surface of said protruding portions;

each of said first and second substrates and said third substrate are positioned together with reference to said first and second positioning marks and said third positioning mark, and bonded to each other at said flat top or bottom surface of said protruding portions so as to form at least one gap between each of said first and second substrates and said third substrate;

a guide protruding portion formed on said bottom surface of said third substrate; and

a guide depression formed on said top surface of said first or second substrate;

wherein said guide protruding portion is arranged at a position, which is different from a facing position to said protruding portions, and in a crossing direction with said protruding portions; and

said guide depression is arranged to opposing said guide protruding portion.

2. An optical waveguide transmitter-receiver module, comprising:

a lower-side substrate having a top surface-side positioning mark on a top surface side thereof and protruding portions formed on a top surface thereof;

an upper-side substrate having an optical waveguide formed therein, optical waveguide entry and exit end faces and a bottom surface-side positioning mark on a flat bottom surface thereof;

wherein said protruding portions have a flat top surface respectively for bonding with said flat bottom surface of said upper-side substrate;

said lower-side and upper-side substrates are positioned together with reference to said top surface-side positioning mark and said bottom surface-side positioning mark, and bonded to each other at said flat top surface of said protruding portions so as to form at least one gap between said lower-side substrate and said upper-side substrate;

a guide protruding portion formed on said flat bottom surface of said upper-side substrate; and

a guide depression formed on said top surface of said lower-side substrate;

wherein said guide protruding portion is arranged at a position, which is different from a facing position to said protruding portions, and in a crossing direction with said protruding portions; and

said guide depression is arranged to opposing said guide protruding portion.

3. An optical waveguide transmitter-receiver module, comprising:

a lower-side substrate having a top surface-side positioning mark on a flat top surface thereof;

an upper-side substrate having an optical waveguide formed therein, optical waveguide entry and exit end faces, a bottom surface-side positioning mark on a bottom surface side thereof and protruding portions formed on a bottom surface thereof on the periphery of said optical waveguide;

wherein said protruding portions have a flat bottom surface respectively for bonding with said flat top surface of said lower-side substrate;

said lower-side and upper-side substrates are positioned together with reference to said top surface-side positioning mark and said bottom surface-side positioning mark, and bonded to each other at said flat bottom surface of said protruding portions so as to form at least one gap between said lower-side substrate and said upper-side substrate;

a guide protruding portion formed on said bottom surface of said upper-side substrate; and

a guide depression formed on said flat top surface of said lower-side substrate;

wherein said guide protruding portion is arranged at a position, which is different from a facing position to said protruding portions, and in a crossing direction with said protruding portions; and

said guide depression is arranged to oppose said guide protruding portion.

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 23, 2023
From: NEOPHOTONICS SEMICONDUCTOR GK
To: NEOPHOTONICS CORPORATION
Reel/Frame 063148/0468 →
CHANGE OF NAME Recorded Oct 22, 2013
From: OKI SEMICONDUCTOR CO., LTD.
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 031627/0671 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 20, 2013
From: LAPIS SEMICONDUCTOR CO., LTD.
To: NEOPHOTONICS SEMICONDUCTOR GK
Reel/Frame 031040/0194 →
CHANGE OF NAME Recorded Mar 12, 2009
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 022408/0397 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 19, 2002
From: TERASHIMA, TOKIHIRO
To: OKI ELECTRIC INDUSTRY CO., LTD.
Reel/Frame 013309/0273 →