IP Library Granted Patent US 6,881,372
Granted Patent B2
US 6,881,372 · App. 10/224,764 · Granted Apr 19, 2005

Solid state polymerized medical services

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Quick Facts
Patent No.
US 6,881,372
App. No.
10/224,764
Granted
Apr 19, 2005
Kind
B2
Abstract

Device articles such as medical devices and parts thereof are thermoformed of a thermoplastic condensable polymer composition. After thermoforming the article is subjected to a solid state polymerization step.

Claims (14)

1. A process for forming an device article from a polymer composition comprising a condensable polymer, the process comprising:

thermoforming the article from the polymer composition; and

subsequently subjecting the formed article to a solid state condensation polymerization step.

2. A process as in claim 1 wherein the thermoforming step comprises injection molding, extrusion or roto-molding.

3. A process as in claim 1 wherein the device article is a member selected from the group consisting of tubing, bags, tube fittings, catheter proximal shafts, guide catheters, diagnostic catheters, catheter manifolds, syringe ports, syringe bodies, shafts, spoons, needles, valves, cell phone or lap-top computer housings or parts thereof, hinges and latches.

4. A process as in claim 1 wherein the condensable polymer is selected from the group consisting of polyesters; polyamides; polyurethane; block copolymers incorporating a polyester, polyamide, polyurethane and/or polyether segment; polycarbonates; copolymers thereof; and blends thereof.

5. A process as in claim 1 wherein the polymer composition further comprises a solid state polymerization catalyst.

6. A process as in claim 1 wherein the article formed has at least one thickness dimension of about 13 mm or less.

7. A process as in claim 1 wherein in said solid state polymerization step the device is heated for a period of about 0.5 hours to about 72 hours at a temperature of at least 120° C. and at least 10° C. below the melting point of the polymer composition.

8. A process as in claim 7 wherein said temperature is about 40° C. to about 70° C. below the melting point of the polymer composition.

9. A process as in claim 7 wherein said temperature is between about 120° C. and 270° C.

10. A process as in claim 7 wherein said temperature is between about 120° C. and about 210° C.

11. A process as in claim 1 wherein said condensable polymer includes at least one functional group selected from the group consisting of active hydrogen groups, ester, amine, ether and carboxylic acid groups.

12. A process as in claim 1 wherein said solid state polymerization step comprises heating the device at a temperature below the melt temperature of the polymer composition and above ambient temperature under vacuum, dry inert gas flow or both.

Assignments (1)
CHANGE OF NAME Recorded Nov 6, 2006
From: SCIMED LIFE SYSTEMS, INC.
To: BOSTON SCIENTIFIC SCIMED, INC.
Reel/Frame 018505/0868 →