IP Library Granted Patent US 6,891,388
Granted Patent B2
US 6,891,388 · App. 10/230,021 · Granted May 10, 2005

Lead protrusion tester

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 6,891,388
App. No.
10/230,021
Granted
May 10, 2005
Kind
B2
Abstract

A lead tester assembly 10 is provided, for use with a circuit board 12 populated with a plurality of electronic components 18 each including at least one lead 20 protruding through the circuit board 16 . A conductive plate element 32 is positioned below the circuit board 16 and is movable between a test active position 24 and a test inactive position 26 . At least one sleeve element 38 is mounted to and is in electrical communication with the conductive plate element 32 . A movable sensor 36 is in electrical communication with the at least one sleeve element 38 when the conductive plate element 32 is in said test inactive position 26 . A non-conductive probe 46 , slidably positioned within the sleeve element 38 , is movable between a lead absent position 50 and a lead present position 52 upon engaging one of the leads 20 . The non-conductive probe 46 forces the movable sensor 36 out of electrical communication with the sleeve element 38 when in the lead present position 52.

Claims (47)

1. A lead tester assembly for use with a circuit board populated with a plurality of electronic components each including at least one lead protruding through the circuit board comprising:

a conductive plate element positioned below the circuit board and movable between a test active position and a test inactive position;

at least one sleeve element mounted to and in electrical communication with said conductive plate element;

a movable sensor in electrical communication with the at least one sleeve element when said conductive plate element is in said test inactive position; and

a non-conductive probe slidably positioned within said at least one sleeve element, said non-conductive probe movable between a lead absent position and a lead present position;

wherein upon said non-conductive probe engaging one of the leads said non-conductive probe forces said movable sensor out of electrical communication with said at least one sleeve element.

2. A lead tester assembly as described in claim 1 , wherein said at least one sleeve element further comprises:

an elbow portion;

a sleeve adjustment screw mounted in said elbow portion and controlling the height of said non-conductive probe above said conductive plate element.

3. A lead tester assembly as described in claim 2 , wherein said at least one sleeve element further comprises:

a sleeve spring surrounding said sleeve adjustment screw, said sleeve spring biasing said at least one sleeve element against said sleeve adjustment screw.

4. A lead tester assembly as described in claim 1 , wherein said at least one sleeve element is gold plated.

5. A lead tester assembly as described in claim 1 , further comprising:

a sensor mounting base mounted to said conductive plate element, said movable sensor mounted on said sensor mounting base.

6. A lead tester assembly as described in claim 1 , further comprising:

an air slide in communication with said conductive plate element, said air slide capable of moving said conductive plate between said test active position and said test inactive position.

7. A lead tester assembly as described in claim 6 , wherein said air slide further comprises:

an adjustable stop mounted on a thread, said adjustable stop allowing adjustment of said test active position.

8. A lead tester assembly as described in claim 1 , further comprising:

a securing assembly securing the circuit board to a base assembly.

9. A lead tester assembly as described in claim 1 , further comprising:

a processor in electrical communication with said conductive plate element and said movable sensor such that said processor monitors when said movable sensor is moved out of electrical communication with said at least one sleeve element.

10. A lead tester assembly as described in claim 1 , further comprising:

an interface panel in communication with said processor and displaying results from said processor.

11. A lead tester assembly as described in claim 1 , further comprising:

a bar code scanner in communication with said processor, said bar code scanner identifying the circuit board.

12. A lead tester assembly as described in claim 1 , wherein said non-conductive probe comprises a bakelite rod.

13. A lead tester assembly as described in claim 12 , wherein said non-conductive probe includes a hardened steel tip.

14. A lead tester assembly as described in claim 9 , wherein said processor includes a PLC input module.

15. A lead tester assembly for use with a circuit board populated with a plurality of electronic components each including at least one lead protruding through the circuit board comprising:

a conductive plate element positioned below the circuit board and movable between a test active position and a test inactive position;

a sensor mounting base positioned below and mounted to said conductive plate element;

at least one conductive sleeve element mounted to and in electrical communication with said conductive plate element;

a spring contact sensor mounted on said sensor mounting base and in electrical communication with the at least one conductive sleeve element when said conductive plate element is in said test inactive position; and

a non-conductive probe slidably positioned within said at least one sleeve element, said non-conductive probe movable from a lead absent position to a lead present position upon said non-conductive probe engaging the at least one lead, said non-conductive probe forcing said spring contact sensor out of electrical communication with said at least one sleeve element when in said lead present position.

16. A lead tester assembly as described in claim 15 , wherein said at least one sleeve element further comprises:

an elbow portion;

a sleeve adjustment screw mounted in said elbow portion and controlling the height of said non-conductive probe above said conductive plate element; and

a sleeve spring surrounding said sleeve adjustment screw, said sleeve spring biasing said at least one sleeve element against said sleeve adjustment screw.

17. A lead tester assembly as described in claim 15 , further comprising:

an air slide in communication with said conductive plate element, said air slide capable of moving said conductive plate between said test active position and said test inactive position.

18. A lead tester assembly as described in claim 17 , wherein said air slide further comprises:

an adjustable stop mounted on a thread, said adjustable stop allowing adjustment of said test active position.

19. A lead tester assembly as described in claim 15 , further comprising:

a processor in electrical communication with said conductive plate element and said spring contact sensor such that said processor monitors when said spring contact sensor is moved out of electrical communication with said at least one conductive sleeve element.

20. A lead tester assembly as described in claim 19 , further comprising:

a bar code scanner in communication with said processor, said bar code scanner identifying the circuit board.