IP Library Patent Application 10230845
Patent Application Utility
App. No. 10/230,845 · Confirmation No. 4281

HIGH DENSITY INTERCONNECTION SYSTEM

Inventor: Timothy B. Billman
Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 View Patent ↗
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Code Description Pages PDF
2005-01-28 PGREF Request for Refund of Publication Fee Paid 4 View
2003-06-27 IFEE Issue Fee Payment (PTO-85B) 1 View
2002-08-28 TRNA Transmittal of New Application 2 View
2002-08-28 SPEC Specification 14 View
2002-08-28 CLM Claims 7 View
2002-08-28 ABST Abstract 1 View
2002-08-28 DRW Drawings-only black and white line drawings 12 View
2002-08-28 OATH Oath or Declaration filed 2 View
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Quick Facts
App. No.
10/230,845
Filed
2002-08-28
Granted
2003-09-02
Art Unit
2833
PTA
0 days