IP Library Granted Patent US 6,965,626
Granted Patent B2
US 6,965,626 · App. 10/232,382 · Granted Nov 15, 2005

Single mode VCSEL

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Quick Facts
Patent No.
US 6,965,626
App. No.
10/232,382
Granted
Nov 15, 2005
Kind
B2
Abstract

A VCSEL having a metallic heat spreading layer adjacent a semiconductor buffer layer containing an insulating structure. The heat spreading layer includes an opening that enables light emitted by an active region to reflect from a distributed Bragg reflector (DBR) top mirror located above the heat spreading layer. A substrate is below the active region. A lower contact provides electrical current to that substrate. The lower contact includes an opening that enables light emitted from the active region to reflect from a distributed Bragg reflector (DBR) lower mirror. Beneficially, the substrate includes a slot that enables light to pass through an opening in the lower contact. That slot acts as an alignment structure that enables optical alignment of an external feature to the VCSEL.

Claims (39)

1. A vertical cavity surface emitting laser, comprising: a bottom distributed Bragg reflector;

an active region over said bottom distributed Bragg reflector;

a top distributed Bragg reflector over said active region; and

a metallic contact between said active region and said top distributed Bragg reflector,

wherein the top and bottom distributed Bragg reflectors define at least a minimum distance over which photons resonate within the vertical cavity surface emitting laser.

2. A vertical cavity surface emitting laser according to claim 1 , wherein said active region has at least one quantum well.

3. A vertical cavity surface emitting laser according to claim 1 , further including a substrate adjacent said active region.

4. A vertical cavity surface emitting laser according to claim 3 , further including a bottom metallic contact over part of said substrate; and

a bottom distributed Bragg reflector in optical contact with said substrate.

5. A vertical cavity surface emitting laser according to claim 4 , wherein said bottom metallic contact is ring-shaped.

6. A vertical cavity surface emitting laser according to claim 4 , wherein said bottom distributed Bragg reflector extends over said bottom metallic contact.

7. A vertical cavity surface emitting laser according to claim 4 , wherein said substrate includes a cavity, and wherein said bottom distributed Bragg reflector has a surface within said cavity.

8. A vertical cavity surface emitting laser according to claim 7 , wherein said bottom metallic contact surrounds said cavity.

9. A vertical cavity surface emitting laser according to claim 1 , further including a lower buffer layer in contact with said active region.

10. A vertical cavity surface emitting laser according to claim 9 , further including a substrate in contact with said lower buffer layer.

11. A vertical cavity surface emitting laser according to claim 10 , further including:

a bottom metallic contact over part of said substrate; and

a bottom distributed Bragg reflector in optical contact with said substrate.

12. A vertical cavity surface emitting laser according to claim 11 , wherein said bottom metallic contact is ring-shaped.

13. A vertical cavity surface emitting laser according to claim 11 , wherein said substrate includes a cavity, and wherein said bottom distributed Bragg reflector has a surface within said cavity.

14. A vertical cavity surface emitting laser according to claim 13 , wherein said bottom metallic contact surrounds said cavity.

15. A vertical cavity surface emitting laser according to claim 13 , wherein said cavity is defined by inwardly sloping walls.

16. A vertical cavity surface emitting laser according to claim 13 , wherein said cavity is aligned with emitted light.

17. A vertical cavity surface emitting laser according to claim 16 , further including an external structure that extends into said cavity.

18. A vertical cavity surface emitting laser according to claim 1 , further comprising a doped semiconductive top buffer layer adjacent said active region.

19. A vertical cavity surface emitting laser according to claim 18 , further comprising an insulating structure within the top buffer layer.

20. A vertical cavity surface emitting laser according to claim 19 , wherein said insulating structure includes an oxide region.

21. A vertical cavity surface emitting laser according to claim 19 , wherein said insulating structure is an ion implanted region.

22. A vertical cavity surface emitting laser according to claim 18 , further including a tunnel junction between said active region and said top buffer layer.

23. A method of forming a vertical cavity surface emitting laser, comprising:

forming a bottom distributed Bragg reflector on a substrate;

producing an active region on a substrate;

forming a metallic contact over part of the active region; and

forming a top distributed Bragg reflector over the active region, wherein the metallic contact is between the active region and the top distributed Bragg reflector, and wherein the top and bottom distributed Bragg reflectors define at least a minimum distance over which photons resonate within the vertical cavity surface emitting laser.

24. A vertical cavity surface emitting laser, comprising:

a first distributed Bragg reflector;

a second distributed Bragg reflector;

an active region located between said first and said second Bragg reflector; and

a top metallic contact between a portion of said active region and said second distributed Bragg reflector, wherein said first and second distributed Bragg reflectors define at least a minimum distance over which photons resonate within the vertical cavity surface emitting laser.

Assignments (8)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: FINISAR CORPORATION
To: II-VI DELAWARE, INC.
Reel/Frame 052286/0001 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 2, 2004
From: HONEYWELL INTERNATIONAL, INC.
To: FINISAR CORPORATION
Reel/Frame 014499/0365 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 26, 2004
From: HONEYWELL INTERNATIONAL, INC.
To: FINISAR CORPORATION
Reel/Frame 014468/0407 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 26, 2004
From: HONEYWELL INTERNATIONAL, INC.
To: FINISAR CORPORATION
Reel/Frame 014468/0371 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 3, 2002
From: TATUM, JAMES A.; GUENTER, JAMES K.; JOHNSON, RALPH H.
To: HONEYWELL INTERNATIONAL INC.
Reel/Frame 013247/0106 →