IP Library Granted Patent US 7,064,962
Granted Patent B2
US 7,064,962 · App. 10/237,823 · Granted Jun 20, 2006

Transponder assembly for use with parallel optics modules in fiber optic communications systems

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Quick Facts
Patent No.
US 7,064,962
App. No.
10/237,823
Granted
Jun 20, 2006
Kind
B2
Abstract

A transponder assembly for use with fiber optic digital communication cables having multiple parallel optic fiber elements. The transponder assembly features a transmitter port and receiver port for connection with separate parallel optic cables for separately transmitting and receiving data and an electrical connector for connecting with computer or communication systems. The transponder assembly includes a parallel optic transmitter module and a parallel optic receiver module having pluggable edge connectors. The assembly also includes a circuit board on which a semiconductor chip useful for signal processing and the electrical connector are mounted. A flex circuit is used in connecting the circuit board to the parallel optic modules. The semiconductor chip and electrical connector are mounted directly across from one another on opposite surfaces of the circuit board.

Claims (13)

1. An apparatus comprising:

a transmitter module having a first edge connector, and photoactive transmitting elements, wherein the first edge connector is electrically associated with the photoactive transmitting elements, and the first edge connector defines a first plane;

a receiver module having a second edge connector, and photoactive receiving elements, wherein the second edge connector is electrically associated with the photoactive receiving elements, and the second edge connector defines a second plane;

a circuit board having a first surface and a second surface, and wherein the circuit board defines a third plane, and wherein the first plane is not co-planar with the third plane, and the second plane is not co-planar with the third plane;

a semiconductor chip electrically connected to the first surface of the circuit board;

an electrical connector electrically connected to the second surface of the circuit board;

a first electrical connection jack electrically connected to the first edge connector;

a second electrical connection jack electrically connected to the second edge connector;

a flex circuit electrically connected to the circuit board, the first electrical connection jack, and the second electrical connection jack; and

a housing mechanically securing the transmitter module, the receiver module, the circuit board, the flex circuit, the first electrical connection jack, and the second electrical connection jack.

2. An apparatus according to claim 1 , further comprising a connector board on which is mounted the first electrical connection jack, and the second electrical connection jack, and wherein the connector board interfaces with the flex circuit.

3. An apparatus according to claim 1 wherein the electrical connector is a pin-array connector, and wherein the semiconductor chip is a Serializer/Deserializer semiconductor chip.

4. An apparatus according to claim 1 wherein the circuit board includes a first ball grid array attachment on the first surface of the circuit board and having a first set of vias for coupling the circuit board to the electrical connector, and wherein the circuit board includes a second ball grid array on the second surface of the circuit board and having a second set of vias, which overlap the first set of vias, for coupling the semiconductor chip to the circuit board.

Assignments (3)
CHANGE OF NAME Recorded Jan 20, 2004
From: STRATOS LIGHTWAVE, INC.
To: STRATOS INTERNATIONAL, INC.
Reel/Frame 014890/0642 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 10, 2003
From: PARACER, INC.
To: STRATOS LIGHTWAVE, INC.
Reel/Frame 013829/0048 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 6, 2002
From: WANG, WILLIAM; CHENG, HENGJU; LO, WEIZEN
To: PARACER, INC.
Reel/Frame 013276/0813 →