Method of connecting a device to a support, and pad for establishing a connection between a device and a support

1. A method of connecting a device to a support, the device having at least a first pad and at least a device pad, the support having at least a second pad, the method comprising:

producing a plurality of electrically conductive, flexible microparticles on the first pad and the second pad; and

connecting the first pad and the second pad via the electrically conductive, flexible microparticles by intermeshing the microparticles in the manner of hook and loop fastening upon connecting the first pad and the second pad, to produce a detachable connection; wherein the flexible microparticles are carbon nanotubes; wherein the first pad is arranged in accordance with a geometry differing from an arrangement geometry of the device pad.

2. The method as claimed in claim 1 , wherein prior to the connecting step at least the exposed ends of the microparticles are metalized, the connecting step including soldering the pads.

3. The method as claimed in claim 1 , wherein prior to the connecting step at least the exposed ends of the microparticles are provided with a conductive adhesive.

4. The method as claimed in claim 1 , wherein prior to the connecting step at least the exposed ends of the microparticles are provided with a non-conductive adhesive, and wherein, during the connecting step, the adhesive is cured such that the adhesive shrinks so that an electrical and mechanical connection is produced.

5. The method as claimed in claim 1 , wherein the electrically conductive, flexible microparticles having a length of between 100 um and 200 um.

6. The method as claimed in claim 1 , wherein a plurality of devices with or without a redistribution layer are provided, the devices being arranged in a wafer, the producing step including producing the electrically conductive, flexible microparticles on all first pads on the wafer, the method further including, prior to connecting, the step of dicing the devices.

7. A method of connecting a device to a support via a redistribution layer arranged on the device, the device including a least a device pad, the redistribution layer including at least a first pad connected to the device pad and the support including at least a second pad, the method comprising:

producing a plurality of electrically conductive, flexible microparticles on the first pad and the second pad;

connecting the first pad and the second pad via the electrically conductive, flexible microparticles by intermeshing the microparticles in the manner of a hook and loop fastening upon connecting the first pad and the second pad, whereby producing a detachable connection; wherein the flexible microparticles are carbon nanotubes; wherein the first pad is arranged in accordance with a geometry differing from an arrangement geometry of the device pad.

8. The method as claimed in claim 7 , wherein prior to the connecting step at least the exposed ends of the microparticles are metalized, the connecting step including soldering the pads.

9. The method as claimed in claim 7 , wherein prior to the connecting step at least the exposed ends of the microparticles are provided with a conductive adhesive.

10. The method as claimed in claim 7 , wherein prior to the connecting step at least the exposed ends of the microparticles are provided with a non-conductive adhesive, and wherein, during the connecting step, the adhesive is cured such that the adhesive shrinks so that an electrical and mechanical connection is produced.

11. The method as claimed in claim 7 , wherein the electrically conductive, flexible microparticles having a length of between 100 um and 200 um.

12. A The method as claimed in claim 7 , wherein a plurality of devices with or without a redistribution layer are provided, the devices being arranged in a wafer, the producing step including producing the electrically conductive, flexible microparticles on all first pads on the wafer, the method further including, prior to connecting, the step of dicing the devices.

13. The method as claimed in claim 8 , wherein the step of metalizing the microparticles includes dipping same into a solder bath or coating same with a metal layer.

14. The method as claimed in claim 9 , wherein the connecting step includes compressing the terminal regions.

15. A device to be connected to a support, comprising:

at least a device pad;

at least a first pad to be connected to a second pad of the support, said first pad and the second pad both including a plurality of electrically conductive flexible microparticles disposed thereon; and

the microparticles intermeshing in the manner of a hook and loop fastening upon said first pad and the second pad being connected, to produce a detachable connection; wherein the flexible microparticles are carbon nanotubes; wherein the first pad is arranged in accordance with a geometry differing from an arrangement geometry of the device pad.

16. The device according to claim 15 , wherein the electrically conductive, flexible microparticles having a length of between 100 um and 200 um.

17. A device to be connected to a support, comprising:

at least one a device pad and an associated redistribution layer, said redistribution layer having at least a first pad connected to a second pad of the support for producing a connection between the device and the support

said first pad and the second pad both including a plurality of electrically conductive, flexible microparticles disposed thereon; and

the microparticles intermeshing in the manner of a hook and loop fastening upon said first pad and the second pad being connected, to produce a detachable connection; wherein the flexible microparticles are carbon nanotubes; wherein the first pad is arranged in accordance with a geometry differing from an arrangement geometry of the device pad.

18. The device according to claim 17 , wherein the electrically conductive, flexible microparticles having a length of between 100 um and 200 um.