Ground arrangement for a device using wireless data transfer
View Patent ↗The invention relates to a ground arrangement of a device using wireless data transfer. In order to improve the electric properties of the device and to minimize the SAR value of the device, at least one electrically conductive additional ground lead ( 73-75 ) is formed in the device in addition to the actual ground lead ( 72 ). In between the ground lead and the additional ground lead, a galvanic coupling is automatically established, when a predetermined switching criterion is fulfilled, and the aforementioned galvanic coupling is automatically released, when a predetermined release criterion is fulfilled. This enables one to change the ground configuration of an antenna such that it is as suitable as possible for the transmission and reception circumstances each time existing.
1. A method for implementing a ground arrangement of a device using wireless data transfer, the device comprising a cover structure composed of at least one cover part, an antenna and a ground lead for the antenna, wherein
in the device, at least one electrically conductive additional ground lead is formed,
in between the ground lead and additional ground lead, a galvanic coupling is automatically established, when a predetermined switching criterion is fulfilled, and
the aforementioned galvanic coupling is released, when a predetermined release criterion is fulfilled.
2. A method according to claim 1 , wherein in the device, several additional ground leads are formed, each of which can be separately coupled to the ground lead and detached from the ground lead.
3. A method according to claim 2 , wherein the additional ground leads are adapted such that they are different from one another in such a manner that the coupling of each additional ground lead to the ground lead changes the effective length of the ground by a different amount from an antenna standpoint.
4. A method according to claim 1 , wherein each additional ground lead is formed of a lead whose free end is physically directed to the desired point in the device.
5. A method according to claim 1 , wherein the ground lead is placed on the circuit board of the device, and the additional ground leads in the cover structure of the device.
6. A method according to claim 5 , wherein the free ends of the additional ground leads are directed to different places in the cover structure of the device.
7. A method according to claim 1 , wherein the ground lead and additional ground leads are placed in different layers of a multi-layer PC board.
8. A method according to claim 1 , wherein the switching and release criteria depend at least on the frequency band each time used by the device.
9. A method according to claim 1 , wherein the switching and release criteria depend at least on the transmission output each time used by the device.
10. A method according to claim 1 , wherein the additional ground lead enables one to affect the electric properties of an antenna.
11. A method according to claim 10 , wherein the additional ground lead enables one to affect the antenna amplification of a terminal device.
12. A method according to claim 10 , wherein the additional ground lead enables one to affect the VSWR value of an antenna.
13. A method according to claim 1 , wherein the additional ground lead enables one to affect the SAR value caused by the device.
14. A device utilizing wireless data transfer, comprising
a cover structure composed of at least one cover part,
an antenna, and
a ground lead, which is fitted inside the cover structure, wherein the terminal device further comprises
at least one electrically conductive additional ground lead,
at least one switch for establishing a galvanic coupling in between the ground lead and the additional ground lead, and
a control means, which is adapted to control the aforementioned at least one switch for establishing the aforementioned galvanic coupling and releasing based on predetermined criteria.
15. A device according to claim 14 , wherein the ground lead is formed on a circuit board in the device, and the additional ground lead at least partly in the cover part of the device.
16. A device according to claim 15 , wherein the additional ground lead is formed inside the cover part material.
17. A device according to claim 15 , wherein the additional ground lead is formed on the inner surface of the cover part.
18. A device according to claim 14 , wherein a ground lead and at least one additional ground lead are formed on circuit board in the device.
19. A device according to claim 18 , wherein the ground lead and additional ground leads are disposed in different layers of a multi-layer PC board.
20. A device according to claim 14 , wherein the additional ground lead is adapted to begin at the point of the ground lead where the distance from the antenna is the biggest, when the distance to the point in question is measured using the shortest route along the ground lead.
21. A device according to claim 14 , wherein it comprises several additional ground leads.
22. A device according to claim 14 , wherein the additional ground leads are formed such that they are different in respect of their physical measures in such a manner that the switching of each changes the electric properties of the antenna in a different way.
23. A device according to claim 14 , wherein it comprises several switches, which are adapted to be coupled to different points of the ground lead.
24. A device according to claim 14 , wherein it is a portable subscriber terminal device.
25. A device according to claim 24 , wherein said portable subscriber terminal comprises a mobile station.