IP Library Granted Patent US 6,943,207
Granted Patent B2
US 6,943,207 · App. 10/243,110 · Granted Sep 13, 2005

Smoke suppressant hot melt adhesive composition

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 6,943,207
App. No.
10/243,110
Granted
Sep 13, 2005
Kind
B2
Abstract

A hot melt adhesive composition that includes thermoplastic polymer, a source of zinc, at least one of aluminum trihydrate and magnesium hydroxide, and no greater than 70% by weight of a source of halogen. Articles that include a porous substrate and the hot melt adhesive composition.

Claims (60)

1. A hot melt adhesive composition comprising

thermoplastic polymer;

a source of zinc comprising zinc oxide;

at least one of aluminum trihydrate and magnesium hydroxide; and

from 2% by weight to 40% by weight of a source of halogen.

2. The hot melt adhesive composition of claim 1 , wherein said thermoplastic polymer comprises ethylene vinyl acetate, polyolefin, ethylene acrylic acid copolymers, polyalkylacrylates, polystyrene, ethylene vinyl alcohol, polyesters, polyamides, rayon, interpolymer of ethylene and octene, or a combination thereof.

3. The hot melt adhesive composition of claim 1 , wherein said composition exhibits a measured smoke value of no greater than 55 when measured according to the Indirect Flame Sealed Chamber Smoke Measurement Test Method.

4. The hot melt adhesive composition of claim 1 , wherein said composition exhibits a measured smoke value of no greater than 35 when measured according to the Direct Flame Flowing Gas Smoke Measurement Test Method.

5. The hot melt adhesive composition of claim 4 , wherein said composition exhibits a measured smoke value of no greater than 55 when measured according to the Indirect Flame Sealed Chamber Smoke Measurement Test Method.

6. The hot melt adhesive composition of claim 1 , comprising from 1% by weight to about 20% by weight said zinc source.

7. The hot melt adhesive composition of claim 1 , comprising from 1% by weight to about 10% by weight said zinc source.

8. The hot melt adhesive composition of claim 1 , comprising from 10% by weight to about 70% by weight aluminum trihydrate.

9. The hot melt adhesive composition of claim 1 , comprising from 10% by weight to about 60% by weight aluminum trihydrate.

10. The hot melt adhesive composition of claim 1 , comprising from 20% by weight to about 50% by weight aluminum trihydrate.

11. The hot melt adhesive composition of claim 1 , comprising

from 1% by weight to about 20% by weight said zinc source; and

from 10% by weight to about 70% by weight aluminum trihydrate.

12. The hot melt adhesive composition of claim 1 , comprising a source of magnesium hydroxide.

13. The hot melt adhesive composition of claim 12 , comprising from 1% by weight to about 70% by weight said magnesium hydroxide.

14. The hot melt adhesive composition of claim 12 , comprising from 1% by weight to about 10% by weight said magnesium hydroxide.

15. The hot melt adhesive composition of claim 12 , further comprising from 1% by weight to about 5% by weight said magnesium hydroxide.

16. The hot melt adhesive composition of claim 11 , further comprising magnesium hydroxide.

17. The hot melt adhesive composition of claim 1 , comprising

from 1% by weight to about 20% by weight zinc;

from 10% by weight to about 70% by weight aluminum trihydrate; and

a source of magnesium.

18. The hot melt adhesive composition of claim 17 , comprising from 1% by weight to about 70% by weight said magnesium source.

19. The hot melt adhesive composition of claim 17 , wherein said source further comprises zinc borate.

20. The hot melt adhesive composition of claim 1 , further comprising wax.

21. The hot melt adhesive composition of claim 1 , wherein said source of halogen comprises halogenated wax.

22. The hot melt adhesive composition of claim 1 , wherein said source of halogen is selected from the group consisting of chlorinated paraffin wax, chlorinated polyolefins, brominated paraffin wax, organic brominated compounds, and combinations thereof.

23. The hot melt adhesive composition of claim 1 , wherein said composition has a viscosity less than 30,000 cps at 300° F.

24. The hot melt adhesive composition of claim 1 , wherein said composition has a viscosity less than 20,000 cps at 300° F.

25. The hot melt adhesive composition of claim 1 , wherein said composition has a viscosity less than 10,000 cps at 300° F.

26. The hot melt adhesive composition of claim 1 , wherein said composition has a viscosity from 2000 cps to 15,000 cps at 300° F.

27. The hot melt adhesive composition of claim 1 , wherein said composition intumesces upon burning.

28. A hot melt adhesive composition comprising

ethylene vinyl acetate copolymer;

a zinc oxide;

at least one of aluminum trihydrate and magnesium hydroxide; and

a source of halogen.

29. The hot melt adhesive composition of claim 28 , further comprising zinc borate.

30. The hot melt adhesive composition of claim 28 , comprising aluminum trihydrate and magnesium hydroxide, and further comprising zinc borate.

31. A hot melt adhesive composition comprising

thermoplastic polymer;

zinc oxide;

magnesium hydroxide;

aluminum trihydrate; and

a source of halogen.

32. The composition of claim 31 , wherein said composition exhibits a measured smoke value of no greater than 45 when measured according to the Indirect Flame Sealed Chamber Smoke Measurement Test Method.

33. A hot melt adhesive composition comprising

thermoplastic polymer;

zinc oxide;

magnesium hydroxide; and

a source of halogen.

34. A hot melt adhesive composition comprising

thermoplastic copolymer;

zinc oxide;

at least 20% by weight aluminum trihydrate; and

a source of halogen.

Assignments (2)
CHANGE OF NAME Recorded Nov 30, 2009
From: H.B. FULLER LICENSING & FINANCING, INC.
To: H.B. FULLER COMPANY
Reel/Frame 023574/0530 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 21, 2003
From: CHANAK, MICHAEL J.; CHASE, CHERYL L. YARIAN; BATDORF, VERNON H.
To: H.B. FULLER LICENSING & FINANCING, INC.
Reel/Frame 014292/0731 →