IP Library › Granted Patent US 6,667,547
Granted Patent Utility
US 6,667,547 · Confirmation No. 6097

HIGH CURRENT CAPACITY SEMICONDUCTOR DEVICE PACKAGE AND LEAD FRAME WITH LARGE AREA CONNECTION POSTS AND MODIFIED OUTLINE

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2003-10-31 IFEE Issue Fee Payment (PTO-85B) 1 View
2002-09-13 TRNA Transmittal of New Application 2 View
2002-09-13 ADS Application Data Sheet 2 View
2002-09-13 SPEC Specification 15 View
2002-09-13 CLM Claims 1 View
2002-09-13 ABST Abstract 1 View
2002-09-13 DRW Drawings-only black and white line drawings 8 View
2002-09-13 OATH Oath or Declaration filed 2 View
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Quick Facts
Patent No.
US 6,667,547
App. No.
10/243,568
Filed
2002-09-13
Granted
2003-12-23
Pub. No.
US20030011051A1
Art Unit
2826
PTA
-7 days