Adhesive particle shielding
View Patent ↗An efficient device for capturing fast moving particles has an adhesive particle shield that includes (i) a mounting panel and (ii) a film that is attached to the mounting panel wherein the outer surface of the film has an adhesive coating disposed thereon to capture particles contacting the outer surface. The shield can be employed to maintain a substantially particle free environment such as in photolithographic systems having critical surfaces, such as wafers, masks, and optics and in the tools used to make these components, that are sensitive to particle contamination. The shield can be portable to be positioned in hard-to-reach areas of a photolithography machine. The adhesive particle shield can incorporate cooling means to attract particles via the thermophoresis effect.
1. A method of maintaining a substantially particle free environment which comprises positioning a particle shield containing an adhesive coating that is capable of capturing free traveling particles and thereby removing the particles from the environment wherein the particle shield comprises: a mounting panel; and a film that is attached to the mounting panel wherein the outer surface of the film has an adhesive coating disposed thereon to intercept the free traveling particles and wherein the film comprises alternating release liner layers and adhesive layers.
2. The method of claim 1 further comprising the step of cooling the film.
3. The method of claim 1 wherein the particles comprise a material that is selected from the group consisting of hydrocarbons, oxides, metals, and mixtures thereof.
4. The method of claim 1 wherein the free traveling particles move at a velocity of between 0 m/s to 100 m/s.
5. A method of maintaining a substantially particle free environment which comprises positioning a particle shield containing an adhesive coating that is capable of capturing free traveling particles and thereby removing the particles from the environment wherein the particle shield comprises: a mounting panel; and a film that is attached to the mounting panel wherein the outer surface of the film has an adhesive coating disposed thereon to intercept the free traveling particles and wherein the film comprises a web of liner material with an adhesive material coated on a surface of the web and wherein the film is wound as a roll with a portion of the adhesive material exposed.
6. The method of claim 5 further comprising the step of cooling the film.
7. The method of claim 5 wherein the particles comprise a material that is selected from the group consisting of hydrocarbons, oxides, metals, and mixtures thereof.
8. The method of claim 5 wherein the free traveling particles move at a velocity of between 0 m/s to 100 m/s.
9. A method of maintaining a substantially particle free environment which comprises positioning a particle shield containing an adhesive coating that is capable of capturing free traveling particles and thereby removing the particles from the environment wherein the particle shield comprises: a mounting panel; and a film that is attached to the mounting panel wherein the outer surface of the film has an adhesive coating disposed thereon to intercept the free traveling particles and wherein the film comprises a liner layer and an adhesive layer coated on the liner layer wherein both the liner and adhesive layers are electrically conductive.
10. The method of claim 9 wherein the panel is electrically grounded.
11. The method of claim 9 further comprising the step of cooling the film.
12. The method of claim 9 wherein the particles comprise a material that is selected from the group consisting of hydrocarbons, oxides, metals, and mixtures thereof.
13. The method of claim 9 wherein the free traveling particles move at a velocity of between 0 m/s to 100 m/s.
14. A method of maintaining a substantially particle free, environment which comprises positioning a particle shield containing an adhesive coating that is capable of intercepting free traveling particles and thereby removing the particles from the environment wherein the particle shield comprises: a mounting panel; and a film that is attached to the mounting panel wherein the outer surface of the film has an adhesive coating disposed thereon to intercept the free traveling particles and wherein the film comprises alternating release liner layers and adhesive layers.
15. The method of claim 14 wherein the particle shield is positioned in a vacuum environment within a photolithography system.
16. The method of claim 14 wherein the particle shield is positioned in a coating device.
17. A method of maintaining a substantially particle free, environment which comprises positioning a particle shield containing an adhesive coating that is capable of intercepting free traveling particles and thereby removing the particles from the environment wherein the particle shield comprises: a mounting panel; and a film that is attached to the mounting panel wherein the outer surface of the film has an adhesive coating disposed thereon to intercept the free traveling particles and wherein the film comprises a web of liner material with an adhesive material coated on a surface of the web and wherein the film is wound as a roll with a portion of the adhesive material exposed.
18. The method of claim 17 wherein the particle shield is positioned in a vacuum environment within a photolithography system.
19. The method of claim 17 wherein the particle shield is positioned in a coating device.
20. A method of maintaining a substantially particle free, environment which comprises positioning a particle shield containing an adhesive coating that is capable of intercepting free traveling particles and thereby removing the particles from the environment wherein the particle shield comprises: a mounting panel; and a film that is attached to the mounting panel wherein the outer surface of the film has an adhesive coating disposed thereon to intercept the free traveling particles and wherein the film comprises a liner layer and an adhesive layer coated on the liner layer wherein both the liner and adhesive layers are electrically conductive.
21. The method of claim 20 wherein the panel is electrically grounded.
22. The method of claim 20 wherein the particle shield is positioned in a vacuum environment within a photolithography system.
23. The method of claim 20 wherein the particle shield is positioned in a coating device.