Mask and method of manufacturing the same, electroluminescence device and method of manufacturing the same, and electronic instrument
A method of manufacturing a mask includes attaching to a first substrate formed with an opening a second substrate formed with a plurality of penetrating holes. The plurality of penetrating holes are disposed inside the opening. The first substrate and the second substrate may be joined together by anode coupling. First and second alignment marks may be used for positioning the second substrate and the first substrate when attaching the second substrate to the first substrate.
1. A method of manufacturing a mask comprising:
attaching to a first substrate formed with an opening a second substrate formed with a plurality of penetrating holes,
wherein the plurality of penetrating holes are disposed inside the opening.
2. The method of manufacturing the mask as defined by claim 1 ,
wherein the first substrate and the second substrate are joined together by anode coupling.
3. The method of manufacturing a mask as defined by claim 1 ,
wherein the first substrate and the second substrate are adhered together by an energy curable adhesive.
4. The method of manufacturing a mask as defined by claim 1 ,
wherein a step of forming the second substrate includes:
forming the plurality of penetrating holes in a silicon wafer; and
cutting the silicon wafer into an outer shape of the second substrate.
5. The method of manufacturing a mask as defined by claim 1 ,
wherein the first substrate has a first alignment mark,
wherein the second substrate has a second alignment mark, and
wherein the first and second alignment marks are used for positioning the second substrate and the first substrate when attaching the second substrate to the first substrate.
6. The method of manufacturing a mask as defined by claim 1 , further comprising forming a mask positioning mark in at least one of the first and second substrates.
7. The method of manufacturing a mask as defined by claim 1 , further comprising forming a magnetic film over the second substrate.
8. The method of manufacturing a mask as defined by claim 1 ,
wherein a plurality of the second substrates is attached to the first substrate,
wherein the first substrate is formed with a plurality of the openings, and
wherein each of the second substrates corresponds with each of the openings when attaching the second substrates to the first substrate.
9. The method of manufacturing a mask as defined by claim 8 ,
wherein the plurality of second substrates are detachably attached to the first substrate.
10. The method of manufacturing a mask as defined by claim 8 , further comprising:
polishing surfaces of the plurality of second substrates attached to the first substrate so that heights of the second substrates become equal.
11. A mask comprising:
a first substrate formed with an opening; and
a second substrate formed with a plurality of penetrating holes and attached to the first substrate,
wherein the plurality of penetrating holes are disposed inside the opening.
12. The mask as defined by claim 11 ,
wherein the first substrate and the second substrate are joined together by anode coupling.
13. The mask as defined by claim 11 ,
wherein the first substrate and the second substrate are adhered together by an energy curable adhesive.
14. The mask as defined by claim 11 ,
wherein the first substrate has a first alignment mark,
wherein the second substrate has a second alignment mark, and
wherein the first and second alignment marks are used for positioning the second substrate and the first substrate.
15. The mask as defined by claim 11 ,
wherein a mask positioning mark is formed in at least one of the first and second substrates.
16. The mask as defined by claim 11 ,
wherein a magnetic film is formed over the second substrate.
17. The mask as defined by claim 11 ,
wherein a plurality of the second substrates is attached to the first substrate,
wherein the first substrate is formed with a plurality of the openings, and
wherein each of the second substrates corresponds with each of the openings when attaching the second substrates to the first substrate.
18. The mask as defined by claim 17 ,
wherein the plurality of second substrates are detachably attached to the first substrate.
19. The mask as defined by claim 17 ,
wherein surfaces of the plurality of second substrates attached to the first substrate are polished so that heights of the second substrates become equal.
20. A method of manufacturing an electroluminescence device comprising forming a film of luminescent material by using the mask as defined by claim 11 .
21. An electroluminescence device manufactured by the method as defined by claim 20 .
22. An electronic instrument having the electroluminescence device as defined by claim 21 .