Methods and apparatuses for an integrated wireless device

1. A housing for a wireless device comprising:

a molded panel;

an internal space;

the internal space defined in part by the molded panel;

at least one molded section in the internal space integrated in the molded panel, the at least one molded section connecting a separate electrical component directly to the wireless device;

metal plating; and

the metal plating attached to the at least one molded section providing electrical contacts integrated into the molded section to electrically connect a separate electrical component to the wireless device,

wherein the separate electrical component is mechanically and electrically connected to the wireless device without additional connectors.

2. The housing of claim 1 , wherein the separate electrical component is an antenna.

3. The housing of claim 2 , wherein the antenna comprises at least one of a cellular telephone antenna, a GPS antenna, and a bluetooth antenna.

4. The housing of claim 2 , wherein the antenna comprises at least one of a planer inverted F antenna, a IFA, a dipole, a monopole, a j pole, or a meanderline.

5. The housing of claim 1 , wherein the molded panel comprises:

a front panel; and

a back panel, wherein

the front panel and the back panel are coupled together to form the internal space.

6. The housing of claim 5 , wherein the at least one molded section resides within the internal space.

7. The housing of claim 5 , wherein the metal plating forms a ring circuit for a cellular telephone.

8. The housing of claim 1 , wherein the separate electrical component comprises at least one of an antenna, a battery, a battery charger circuit, a ring circuit, a vibrator circuit, a keyboard circuit, and a printed circuit board.

9. The housing of claim 1 , wherein the wireless device comprises at least one of a cellular telephone, an electronic game, a personal digital assistant, a wireless enabled computer, a handheld radio, a portable television, and a portable DVD player.

10. The housing of claim 1 , wherein the at least one molded section comprises:

a base plastic section; and

a platable plastic, wherein

the base plastic section comprises a portion of the back panel and the platable plastic is selectively molded to the base plastic section such that the metal plating exists only where the platable plastic exists, wherein the metal plating forms an antenna for and connects the antenna electrically to the wireless device.

11. The housing of claim 1 , wherein the metal plating comprises a metal foil attached to the at least one molded section.

12. A housing for a wireless device comprising:

at least one front panel;

at least one back panel;

the at least one front panel coupled to the at least one back panel forming at least one internal space;

at least one mid panel;

the at least one mid panel existing between the at least one front panel and the at least one back panel and residing in the at least one internal space;

the at least one mid panel comprising at least one molded section internal to a space defined by the at least one front panel and at least one back panel, the at least one molded section connecting a separate electrical component directly to the wireless device;

metal plating; and

the metal plating attached to the at least one molded section providing electrical contacts integrated into the molded section to electrically connect a separate electrical component to the wireless device,

wherein the separate electrical component is mechanically and electrically connected to the wireless device without additional connectors.

13. The housing of claim 12 , wherein the separate electrical component comprises an antenna integral to the molded panel.

14. The housing of claim 13 , wherein the antenna comprises at least one of a planer inverted F antenna, a IFA, a dipole, a monopole, a j pole, or a meanderline.

15. The housing of claim 12 , wherein

the at least mid panel comprises at least one side wall; and

the at least one molded section resides on the at least one side wall.

16. The housing of claim 12 , wherein the separate electrical component comprises at least one of an antenna, a battery, a battery charger, a ring circuit, a vibrator circuit, a keyboard circuit, and a printed circuit board.

17. The housing of claim 16 , wherein the antenna comprises at least one of a cellular telephone antenna, a GPS antenna, and a bluetooth antenna.

18. The housing of claim 12 , wherein the wireless device comprises at least one of a cellular telephone, an electronic game, a personal digital assistant, a wireless enabled computer, a handheld radio, a portable television, and a portable DVD player.

19. The housing of claim 12 , wherein the at least one molded section comprises:

a base plastic section; and

a platable plastic, wherein

the base plastic section comprises at least a portion of the mid panel and the platable plastic is selectively molded to the base plastic section such that the metal plating exists only where the platable plastic exists, wherein the metal plating forms an antenna for and connects the antenna electrically to the wireless device.

20. The housing of claim 12 , wherein the at least one molded section resides within the internal space.

21. The housing of claim 12 , wherein the metal plating comprises metal foil.

22. A method of making a housing for a wireless device having components integrally molded thereto, the method comprising the steps of:

designing a housing for a wireless device having at least one molded section internal to a space defined by the housing;

forming the housing such that the at least one internal molded section is integral to the housing and shaped to hold a separate electrical component; and

plating the at least one internal molded section of the housing, wherein

the separate electrical component is mechanically and electrically connected to the wireless device without additional connectors.

23. The method of claim 22 , wherein the forming step comprises:

injecting a first non-platable plastic into a mold; and

injecting a second platable plastic into a mold such that the housing is formed.

24. The method of claim 23 , wherein the plating step comprises:

using an electrolytic process to plate the platable plastic.

25. The method of claim 23 , wherein the plating step comprises:

using an electroless process to plate the platable plastic.

26. The method of claim 22 , wherein the plating step comprises:

placing a metal foil on the at least one internal molded section; and

hot stamping the metal foil to the at least one internal molded section.

27. The method of claim 22 , wherein the plating step comprises:

placing a metal foil on the at least one internal molded section; and

embossing the metal foil to the at least one internal molded section.