Uniform deposition of organic layer
View Patent ↗A method to ensure uniform deposition of organic layer is disclosed. Since the organic layer is very thin, any deviation from the target thickness will result in visible optical defects. A homogenous layer which exhibits good coating behaviour with organic materials is provided beneath the organic layer. By covering the metal interconnects, the adverse effect on the uniformity of the polymer layer is reduced or prevented.
1. A device comprising:
a substrate with an active region comprising at least one active component, wherein the active component includes an organic material;
a cap bonding region surrounding the active region;
conductive interconnects having first and second opposing major surfaces formed on the substrate, the first major surfaces in contact with the substrate, wherein at least portions of the conductive interconnects are located outside the active region on the substrate;
an insulating homogenous layer located on the substrate above the conductive interconnects outside the active region and not in the active region;
a subsequently deposited layer including the organic material, the subsequently deposited layer located at least in the active region wherein the homogenous layer has a side surface that is substantially perpendicular to the first and second opposing major surfaces of the conductive interconnects, the side surface contacting the subsequently deposited layer and reducing topography created by the second major surfaces of the conductive interconnects to promote uniform deposition of the subsequently deposited layer on the substrate at least inside the active region; and
a cap bonded to the substrate in the cap bonding region.
2. The device of claim 1 comprises an OLED device.
3. The device of claim 1 comprises a flexible OLED device.
4. The device of claim 1 wherein the homogenous layer comprises a photosensitive material.
5. The device of claim 4 wherein the photosensitive material comprises photoresist or polyimide.
6. The device of claim 4 wherein:
an adhesive is used to bond the cap to the substrate; and
the cap, the homogenous layer and the adhesive form a sealing system to encapsulate the at least one active component.
7. The device of claim 4 wherein the homogenous layer also serves as a surface protection layer which protects a device layer or device layers below from damage when material from above the homogenous layer is removed.
8. The device of claim 7 wherein:
an adhesive is used to bond the cap to the substrate; and
the cap, the homogenous layer and the adhesive form a sealing system to encapsulate the at least one active component.
9. The device of claim 8 wherein the homogenous layer allows removal of material from the subsequently deposited layer without damaging a device layer or layers below the homogenous layer.
10. The device of claim 9 wherein an adhesive is used to bond the cap to the substrate.
11. The device of claim 10 wherein the cap, the homogenous layer and the adhesive form a sealing system.
12. The device of claim 11 wherein materials of the sealing system are selected to provide desired sealing characteristics.
13. The device of claim 4 wherein:
an adhesive is used to bond the cap to the substrate; and
the cap, the homogenous layer and the adhesive form a sealing system to encapsulate the at least one active component.
14. The device of claim 4 wherein the homogenous layer also serves as a surface protection layer which protects a device layer or device layers below from damage when material from above the homogenous layer is removed.
15. The device of claim 14 wherein:
an adhesive is used to bond the cap to the substrate; and
the cap, the homogenous layer and the adhesive form a sealing system to encapsulate the at least one active component.
16. The device of claim 14 wherein:
an adhesive is used to bond the cap to the substrate; and
the cap, the homogenous layer and the adhesive form a sealing system to encapsulate the at least one active component.
17. The device of claim 6 wherein the homogenous layer also serves as a surface protection layer which protects a device layer or device layers below from damage when material from above the homogenous layer is removed.
18. The device of claim 17 wherein:
an adhesive is used to bond the cap to the substrate; and
the cap, the homogenous layer and the adhesive form a sealing system to encapsulate the at least one active component.
19. The device of claim 1 , wherein the conductive interconnects include a metal.
20. The device of claim 1 , wherein the homogenous layer includes Novolak resin.
21. The device of claim 1 , wherein the subsequently deposited layer includes a polymer.
22. The device of claim 9 , wherein the homogenous layer allows removal of material by laser ablation of a layer disposed above the homogeneous layer without damaging device layer or layers below the homogenous layer.
23. The device of claim 11 , wherein a portion of the homogenous layer is removed partially during the removal of material disposed above the homogeneous layer.
24. An OLED device comprising:
a substrate wit an active region, the active region comprising at least one OLED cell having at least one organic layer between top and bottom electrodes;
a cap bonding region surrounding the active region;
conductive interconnects having first and second opposing major surfaces formed on the substrate, the first major surfaces in contact with the substrate, wherein at least portions of the conductive interconnects are located outside the active region on the substrate, the conductive interconnects coupled to the at least one OLED cell;
an insulating homogenous layer located on the substrate above the conductive interconnects outside the active region and not in the active region;
at least one organic layer located at least in the active region, wherein the homogenous layer has a side surface substantially perpendicular to the first and second opposing major surfaces of the conductive interconnects, the side surface contacting the organic layer, the homogenous layer reducing topography created by the second major surfaces of the conductive interconnects to promote uniform deposition of the at least one organic layer on the substrate at least inside the active region; and
a cap bonded to the cap bonding region to encapsulate the OLED device.
25. The OLED device of claim 24 comprises a flexible OLED device.
26. The OLED device of claim 24 wherein the homogenous layer comprises either a photosensitive or non-photosensitive material.
27. The OLED device of claim 26 wherein:
an adhesive is used to bond the cap to the substrate; and
the cap, the homogenous layer and the adhesive form a sealing system to encapsulate the at least one OLED cell.
28. The OLED device of claim 26 wherein the homogenous layer also serves as a surface protection layer which protects a device layer or device layers below from damage when organic material from the at least one organic layer above the homogenous layer is removed.
29. The OLED device of claim 28 wherein:
an adhesive is used to bond the cap to the substrate; and
the cap, the homogenous layer and the adhesive form a sealing system to encapsulate the at least one OLED cell.
30. The device of claim 24 , wherein the conductive interconnects include a metal.
31. The device of claim 24 , wherein the subsequently deposited layer includes a polymer.
32. The device of claim 24 , wherein the homogenous layer includes Novolak resin.
33. The device of claim 28 , wherein the homogenous layer allows removal of material from above the homogeneous layer without damaging device layer or layers below the homogenous layer.
34. The device of claim 28 , wherein a portion of the homogenous layer is removed partially during the removal of material from above the homogeneous layer.
35. A device comprising:
a substrate wit an active region, the active region comprising at least one active component configured to emit light;
conductive interconnects having first and second opposing major surfaces formed on the substrate, the first major surfaces in contact with the substrate, wherein at least portions of the conductive interconnects are located outside the active region on the substrate, the conductive interconnects coupled to the at least one active component;
an insulating homogenous layer located on the substrate above the conductive interconnects outside the active region, but not in the active region; and
a subsequently deposited layer capable of emitting light located at least in the active region, wherein the homogenous layer has a side surface substantially perpendicular to the first and second opposing major surfaces of the conductive interconnects, the side surface contacting the subsequently deposited layer, the homogenous layer reducing topography created by the second major surfaces of the conductive interconnects to promote uniform deposition of the subsequently deposited layer on the substrate.
36. The device of claim 35 further comprises:
a cap bonding region surrounding the active region; and
a cap bonded to the cap bonding region to encapsulate the device.
37. The device of claim 35 comprises an OLED device.
38. The device of claim 37 further comprises:
a cap bonding region surrounding the active region; and
a cap bonded to the cap bonding region of the substrate to encapsulate the device.
39. The device of claim 35 wherein the homogenous layer comprises either a photosensitive or non-photosensitive material.
40. The device of claim 39 wherein:
an adhesive is used to bond the cap to the substrate; and
the cap, the homogenous layer and the adhesive form a sealing system to encapsulate the at least one active component.
41. The device of claim 39 wherein the homogenous layer also serves as a surface protection layer which protects a device layer or device layers below from damage when material from above the homogenous layer is removed.
42. The device of claim 41 wherein:
an adhesive is used to bond the cap to the substrate; and
the cap, the homogenous layer and the adhesive form a sealing system to encapsulate the at least one active component.
43. The device of claim 41 , wherein the homogenous layer allows removal of material by laser ablation above the homogeneous layer without damaging a device layer or layers below the homogenous layer.
44. The device of claim 41 , wherein a portion of the homogenous layer is removed partially during the removal of material disposed above the homogeneous layer.
45. The device of claim 35 , wherein the conductive interconnects include a metal.
46. The device of claim 35 , wherein the homogenous layer includes Novolak resin.
47. The device of claim 35 , wherein the subsequently deposited layer includes a polymer.