Inkjet device encapsulated at the wafer scale

1. An ink jet print head package including:

a) a chip having a top surface and a bottom surface and having at least one microfabricated device formed in or on the chip,

b) a first molded hollow cap bonded to the top surface which, in plan view, overlays part or all of said at least one device, and

c) a second molded hollow cap bonded to the bottom surface of the chip, wherein the first cap and the second cap have been bonded to the chip at the wafer stage prior to separation of the wafer into individual packages.

2. The ink jet print head package of claim 1 , further including at least one bond pad located outside the footprint of the first cap.

3. The ink jet print head package of claim 1 , wherein the second molded cap bonded to the bottom surface of the chip, in plan view, overlays part or all of the at least one device.

4. The ink jet print head package of claim 1 , wherein the at least one microfabricated device of the ink jet print head package is an ink ejection device.

5. The ink jet print head package of claim 4 , further including that a microfabricated device of the ink jet print head package is an accelerometer.

6. The ink jet print head package of claim 4 , further including that a microfabricated device of the ink jet print head package is a light emitting device.

7. The ink jet print head package of claim 4 , further including that a microfabricated device of the ink jet print head package is a laser.

8. The ink jet print head package of claim 4 , wherein the fit cap has at least one aperture to allow ink ejected by the at least one ink ejection device to escape to the environment.

9. The ink jet print head package of claim 8 , further including at least one ink supply aperture extending through the chip to transport ink to the at least one ink ejection device.

10. The inkjet print head package of claim 9 , wherein there is one aperture for each ink ejection device.

11. The inkjet print head package of claim 9 , wherein there is one aperture for a plurality of ink ejection devices.

12. The ink jet pint head package of claim 9 , wherein there is provided a plurality of ink ejection devices, the plurality of ink ejection devices arranged into two or more groups of longitudinally extending lines of ink ejection devices, and wherein the aperture is a longitudinally extending slot in the chip communicating with the ink ejection devices of at least one group.

13. The ink jet print head package of claim 12 , wherein each slot communicates with two groups of ink section devices.

14. The ink jet print head package of claim 1 , wherein the first cap includes a portion at least partially parent or translucent to electromagnetic radiation at one or more wavelengths.

15. The ink jet print head package of claim 1 , wherein the first cap includes at least one sub-portion in the central portion of the first cap capable of refracting electromagnetic radiation passing therethrough.

16. The ink jet print head package of claim 1 , wherein the second molded hollow cap bonded to the bottom surface of the chip defines at least one bottom region cavity.

17. The ink jet print head package of claim 16 , wherein the at least one bottom region cavity stores ink.

18. The ink jet print head package of claim 17 , wherein the second cap has at least one wall extending from the central portion of the second cap bonded with the bottom surface of the chip to divide the bottom region cavity into two or more channels.

19. The ink jet print head package of claim 18 , wherein the second cap has at least one aperture extending through the central portion of the second cap to transport ink to a respective channel from the outside environment.

20. The ink jet print head package of claim 18 , wherein the two or more channels store different coloured inks.

21. The ink jet print head package of claim 18 , wherein the two or more channels store the same coloured ink.