IP Library Granted Patent US 6,987,871
Granted Patent B2
US 6,987,871 · App. 10/253,841 · Granted Jan 17, 2006

Electrostatic discharge protection of a capacitive type fingerprint sensing array

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Quick Facts
Patent No.
US 6,987,871
App. No.
10/253,841
Granted
Jan 17, 2006
Kind
B2
Abstract

A planar fingerprint pattern detecting array includes a large number of individual skin-distance sensing cells that are arranged in a row/column configuration. Each sensing cell includes an amplifier having an ungrounded input node and an ungrounded output node. Output-to-input negative feedback that is sensitive to the fingerprint pattern is provided for each amplifier by way of (1) a first capacitor plate that is placed vertically under the upper surface of a dielectric layer and is connected to the ungrounded amplifier input node, (2) a second capacitor plate that is placed vertically under the upper surface of the dielectric layer in close horizontal spatial relation to the first capacitor plate and is connected to the ungrounded output node, and (3) an ungrounded fingertip whose fingerprint pattern is to be detected, which ungrounded fingertip is placed on the upper surface of the dielectric layer in close vertical spatial relation with the first and second capacitor plates. Electrostatic discharge protection relative to electrostatic potential that may be carried by the ungrounded fingertip is provided by placing a number of grounded metal paths within the dielectric layer to spatially surround each of the first and second capacitor plates, this being done in a manner that does not disturb the ungrounded state of the fingertip.

Claims (11)

1. An apparatus, comprising:

a semiconductor integrated circuit;

a plurality of sensor cells formed as part of the integrated circuit, each sensor cell comprising,

a first capacitor late and a second capacitor plate, and

an amplifier circuit having an input terminal connected to the first capacitor plate and an output terminal connected to the second capacitor plate to provide a feedback loop from the output of the amplifier circuit to the input of the amplifier circuit; and

a conductive oath positioned within a dielectric layer between adjacent cells and formed as part of the integrated circuit to protect the sensor cell from an electrostatic potential,

wherein the conductive path and the capacitor plates are embedded within said dielectric layer.

2. The apparatus of claim 1 , wherein the conductive path comprises metal.

3. The apparatus of claim 1 , wherein the amplifier circuit comprises a signal-inverting amplifier circuit and the feedback of the amplifier comprises negative-signal feedback.

4. The apparatus of claim 1 , further comprising:

a logic circuit for selectively connecting the output of the amplifier circuit to an output circuit to determine changes in an output voltage caused by an object in close proximity to an upper surface of the sensor cells.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 30, 2015
From: AUTHENTEC, INC.
To: APPLE INC.
Reel/Frame 035552/0286 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNMENT DOCUMENT TO IDENTIFY UPEK, INC. AS A DELAWARE CORPORATION PREVIOUSLY RECORDED ON REEL 026944 FRAME 0942. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT OF ASSIGNOR'S INTEREST. Recorded Oct 3, 2012
From: UPEK, INC.
To: AUTHENTEC, INC.
Reel/Frame 029074/0347 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 21, 2011
From: UPEK, INC.
To: AUTHENTEC, INC.
Reel/Frame 026944/0942 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 31, 2004
From: STMICROELECTRONICS, INC.; STMICROELECTRONICS N.V.
To: UPEK, INC.
Reel/Frame 014475/0851 →