IP Library Granted Patent US 6,870,149
Granted Patent B2
US 6,870,149 · App. 10/254,140 · Granted Mar 22, 2005

Superposed multi-junction color APS

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Quick Facts
Patent No.
US 6,870,149
App. No.
10/254,140
Granted
Mar 22, 2005
Kind
B2
Abstract

A CMOS image sensor obtains color through the use of two or three superposed layers. Each pixel in the image sensor includes a plurality of superposed photosensitive p-n junctions with individual charge integration regions. The combination of each of the superposed layers provides increased sensitivity and resolution of a single chip color imager.

Claims (26)

1. A device comprising:

a semiconductor substrate, having a first surface which is arranged to receive incoming irradiation;

at least first and second photoreceptor parts located in said semiconductor substrate, and arranged in said semiconductor substrate in a way such that charges produced by different wavelengths of said incoming radiation are respectively collected by said at least first and second photoreceptor parts; and

at least first and second separately controlled reset transistors for respectively resetting said at least first and second photoreceptor parts.

2. A device as in claim 1 , wherein said first and second photoreceptor parts are at different depths in the semiconductor substrate.

3. A device as in claim 1 , wherein said first and second photoreceptor parts are arranged in first and second areas with different semiconductor characteristics.

4. A device as in claim 1 , further comprising a third photoreceptor part also arranged in said semiconductor substrate to collect charges produced by different wavelengths of light than the charges collected by said first and second photoreceptor parts.

5. A device as in claim 4 , wherein said first, second and third photoreceptor parts each receive light of predominant primary colors.

6. A device as in claim 4 , wherein said first, second and third semiconductor parts are superimposed one over another.

7. A device as in claim 4 , wherein said first, second and third semiconductor parts are partially overlapping one another.

8. A device as in claim 3 , wherein one of said first and second areas comprises a P region, and another of said first and second areas comprises an N region.

9. A device as in claim 4 , further comprising a third separately controlled reset transistor for resetting the third photoreceptor part.

10. A device as in claim 1 , further comprising first and second output circuits, respectively connected to said first and second photoreceptor parts, and producing output signals based on charges collected by said first and second-photoreceptor parts, respectively.

11. A device as in claim 1 , wherein said device is an active pixel sensor capable of operating in 4:4:4 sampling mode.

12. An active pixel sensor comprising:

a photoreceptor region formed in a substrate and comprising:

a well region located within said substrate and doped to a first conductivity type;

a buried region located within said well region and doped to a second conductivity type; and

a surface region located within said well region near the surface of said substrate and doped to said first conductivity type, said regions collecting charges associated with respective wavelengths of applied light;

first, second, and third storage regions for respectively receiving and storing said charges associated with said respective wavelengths of applied light; and

first, second, and third reset transistors for separately controlling the reset of said first, second, and third storage regions.

13. An active pixel sensor as in claim 12 , further comprising output circuits for selectively outputting signals from the first, second, and third storage regions representing the amount of charges stored in said storage regions.

14. An active pixel sensor as in claim 13 wherein said output circuits comprise a first, second, and third output transistor associated with said respective first, second, and third storage regions.

15. An active pixel sensor as in claim 13 , wherein said active pixel sensor is capable of operating in 4:4:4 sampling mode.

16. An active pixel sensor as in claim 12 , wherein said first conductivity type is n-type and said second conductivity type is p-type.

17. An active pixel sensor as in claim 16 , wherein at least one of said first, second, and third reset transistors comprises an NMOS transistor, and at least one of said first, second, and third reset transistors comprises a PMOS transistor.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 1, 2016
From: PHOTOBIT CORPORATION
To: MICRON TECHNOLOGY, INC.
Reel/Frame 040188/0115 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 1, 2016
From: MICRON TECHNOLOGY, INC.
To: APTINA IMAGING CORPORATION
Reel/Frame 040542/0035 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 24, 2016
From: BEREZIN, VLADIMIR
To: PHOTOBIT CORPORATION
Reel/Frame 040100/0773 →