Devices with organic crystallite active channels
View Patent ↗A method fabricates ICs in which organic semiconductor crystallites serve as active channels of semiconductor devices. The method includes providing a substrate with a surface that has a preselected pattern of adhesion sites located thereon. The adhesion sites are prepared to adhere crystallites of an organic semiconductor. The method also includes applying a plurality of crystallites of the organic semiconductor to the surface to enable a portion of the applied crystallites to adhere at the prepared adhesion sites.
1. A method, comprising:
providing a substrate whose surface has a preselected pattern of adhesion sites located thereon, the adhesion sites being prepared to adhere crystallites of an organic semiconductor; and
applying a plurality of crystallites of the organic semiconductor to the surface to enable a portion of the applied crystallites to adhere to at least a portion of the prepared adhesion sites.
2. The method of claim 1 , wherein portions of the surface between the adhesion sites are functionalized with functional groups that do not adhere the crystallites of the organic semiconductor.
3. The method of claim 2 , wherein the portions are functionalized with fluorinated functional groups.
4. The method of claim 1 , wherein surfaces of the adhesion sites are functionalized with functional groups that adhere the crystallites of the organic semiconductor.
5. The method of claim 4 , wherein surfaces of the crystallites of the organic semiconductor are functionalized with functional groups that bind to the adhesion sites.
6. The method of claim 5 , wherein the surfaces of the adhesion sites and crystallites are one of both functionalized with aromatic groups and both functionalized with hydrophilic groups.
7. The method of claim 1 , wherein the providing includes electrically charging the adhesion sites to attract a portion of charged ones of the crystallites.
8. The method of claim 1 , wherein a portion of the adhesion sites have gate electrodes associated with the adhesion sites.
9. The method of claim 8 , wherein the providing further comprises charging the gate electrodes to enable the associated adhesion sites to bind a portion of the charged ones of the crystallites.
10. The method of claim 1 , wherein the applying comprises causing a fluid to transport the crystallites of the organic semiconductor over the surface.
11. The method of claim 1 , wherein the applying comprises causing the crystallites of the organic semiconductor to sediment through a fluid onto the surface.
12. The method of claim 1 , wherein the applying comprises:
causing the crystallites of organic semiconductor to adhere to a surface of a stamp; and
bringing the surface of the stamp in contact with the surface of the substrate.
13. The method of claim 1 , further comprising:
then, removing from the surface ones of the crystallites that are unbound at adhesion sites; and
fixing to the surface ones of the crystallites that are bound at the adhesion sites.
14. An integrated circuit, comprising:
a substrate and an array of organic field effect transistors on the substrate, each transistor comprising:
a crystallite of organic semiconductor that is located over the substrate;
a gate structure positioned to control a conductivity of a channel portion of the crystallite; and
conductive source and drain electrodes located on opposite ends of the channel portion; and
wherein the largest dimension of each crystallite is 1 millimeter or less.
15. The integrated circuit of claim 14 , wherein the gate structure includes a gate electrode that is located in the substrate.
16. An integrated circuit, comprising:
a substrate and an array of organic field effect transistors located on the substrate, each transistor comprising:
a crystallite of organic semiconductor that is located over the substrate;
a gate structure positioned to control a conductivity of a channel portion of the crystallite; and
conductive source and drain electrodes located on opposite ends of the channel portion; and
a pattern of separated adhesion sites, each adhesion site interposed between a region of the substrate and an associated one of the crystallites, the adhesion sites having a chemical composition configured to bind the crystallites to the substrate.
17. The integrated circuit of claim 14 , wherein different ones of the transistors have channels that are physically isolated from each other.
18. The integrated circuit of claim 14 , wherein the conductive source and drain electrodes are located on the substrate.
19. The integrated circuit of claim 14 , wherein the crystallite of each transistor is physically isolated from the crystallites of the remaining one or more transistors.
20. The integrated circuit of claim 19 , wherein the crystallites have largest dimensions of 100 microns or less.
21. The integrated circuit of claim 16 , wherein the largest dimension of each crystallite is 1 millimeter or less.