Split spring providing multiple electrical leads for MEMS devices
View Patent ↗An integrated device has a spring having at least two split parts that are not in direct electrical contact with each other. The integrated device also has a substrate and a movable part, where both parts of the spring are configured between the substrate and the movable part to support the movable part on the substrate. The two or more split parts of the spring enable two or more independent voltages to be applied to the movable part. The split spring of the invention may be used in MEMS devices for optical switches in order to provide independent voltages to the movable part(s) in those devices.
1. A MEMS device comprising:
(a) a stationary part;
(b) a movable part movably coupled to the stationary part; and
(c) a multipart spring having a plurality of cooperating parts connected between the stationary part and the movable part, wherein:
the plurality of cooperating parts includes a first cooperating part and one or more other cooperating parts;
the first cooperating part is physically separated from the one or more other cooperating parts and is adapted to provide a first electrically independent lead between the stationary part and the movable part; and
the one or more other cooperating parts are adapted to provide at least a second electrically independent lead between the stationary part and the movable part.
2. The invention of claim 1 , wherein the multipart spring has a serpentine shape.
3. The invention of claim 1 , wherein the MEMS device is formed in a wafer, the wafer comprising:
a first layer;
a second layer formed over the first layer; and
a third layer formed over the second layer, wherein:
the second layer electrically insulates the first layer from the third layer; and
the movable part and the multipart spring are formed in the third layer.
4. The invention of claim 1 , wherein the movable part comprises:
a first plate movably coupled to the stationary part; and
a second plate movably coupled to the first plate, wherein:
the multipart spring and a second spring are connected between the stationary part and the first plate; and
the multipart spring and the second spring are adapted to provide at least three electrically independent leads to the first plate.
5. The invention of claim 1 , wherein the movable part has a reflective surface and the MEMS device is an element of an optical cross-connect having two or more MEMS devices.
6. The invention of claim 1 , wherein:
the MEMS device is formed in a multilayered wafer; and
the multipart spring is formed in a single layer of the wafer.
7. The invention of claim 6 , wherein the single layer is an electrically conducting layer.
8. The invention of claim 1 , wherein the physical separation is smaller than a largest dimension of any one of the cooperating parts.
9. The invention of claim 8 , wherein the largest dimension is a largest linear dimension.
10. The invention of claim 1 , wherein a footprint of the first cooperating part overlaps with a footprint of at least one other cooperating part.
11. A MEMS device comprising:
(a) a stationary part;
(b) a movable part movably coupled to the stationary part; and
(c) a multipart spring having a plurality of cooperating parts connected between the stationary part and the movable part, wherein:
each cooperating part comprises a conducting material and is adapted to contribute in a substantial manner to a generation of a spring force; and
the multipart spring is adapted to provide at least two electrically independent leads between the stationary part and the movable part.
12. Apparatus comprising:
means for applying a first voltage between a stationary part of a MEMS device and a movable part of the MEMS device; and
means for applying a second voltage, independent of the first voltage, between the stationary part and the movable part, wherein:
the movable part is movably coupled to the stationary part by a multipart spring having a plurality of cooperating parts connected between the stationary part and the movable part;
the plurality of cooperating parts includes a first cooperating part and one or more other cooperating parts;
the first cooperating part is physically separated from the one or more other cooperating parts;
the first voltage is applied via the first cooperating part of the multipart spring; and
the second voltage is applied via an electrical lead provided by the one or more other cooperating parts of the multipart spring.
13. The invention of claim 12 , wherein:
the MEMS device is formed in a multilayered wafer; and
the multipart spring is formed in a single layer of the wafer.
14. The invention of claim 13 , wherein the single layer is an electrically conducting layer.
15. The invention of claim 12 , wherein the physical separation is smaller than a largest dimension of any one of the cooperating parts.
16. The invention of claim 15 , wherein the largest dimension is a largest linear dimension.
17. The invention of claim 12 , wherein a footprint of the first cooperating part overlaps with a footprint of at least one other cooperating part.