Methods for shielding one or more circuit of a printed circuit board
View Patent ↗Methods for forming a metal shield on a printed circuit board ( 10 ) include depositing a first layer of metal ( 41 ) on a substrate ( 22 ) of the printed circuit board ( 10 ), depositing a first layer of dielectric material ( 42 ) on the first layer of metal ( 41 ), printing one or more circuits ( 21, 21′ ) on the first dielectric layer ( 42 ), depositing a second layer of dielectric material ( 43 ) over the one or more printed circuits ( 21, 21′ ), forming a trench-like opening ( 44 ) in the two layers of dielectric material ( 42, 43 ) surrounding the one or more printed circuits ( 21, 21′ ) so that the metal of the first layer ( 41 ) is exposed by the trench-like opening ( 44 ), depositing a second layer of metal ( 27 ) on the second layer of dielectric material ( 43 ) such that the second layer of metal ( 27 ) plates the trench-like opening ( 44 ) and makes electrical contact with the first metal layer ( 41 ).
1. A method for shielding one or more circuits of a printed circuit board, comprising the steps of:
depositing a first layer of metal on a substrate of the printed circuit board;
depositing a first layer of dielectric material on the first layer of metal;
printing more than one circuit on the first dielectric layer;
depositing a second dielectric layer over the first dielectric layer and over the more than one printed circuit thereon;
forming a trench opening in the two layers of dielectric material such that the trench opening surrounds the more than one printed circuit, and the metal of the first layer is exposed by the trench opening;
depositing a second layer of metal over the second layer of dielectric material such that the second layer of metal plates the trench opening and makes electrical contact with the first metal layer; and providing one or more gaps in the metal deposited in the trench opening and routing a circuit trace therethrough.
2. The method of claim 1 , including the step of creating a solder pad at each location where an electrical connection is to be made to the one or more printed circuits by removing a border of metal from the second layer of metal, the border surrounding each connection location, thereby leaving a portion of the second layer of metal at each connection location.
3. The method of claim 2 , including the step of providing a microvia in each solder pad, the microvia extending through the second layer of dielectric material to the metal of the one or more printed circuits.
4. The method of claim 3 , including the step of soldering an electrical component to one or more of the solder pads.
5. The method of claim 1 , wherein the more than one printed circuit comprise at least two printed circuits, including the steps of providing a metal plated trench opening between two printed circuits and electrically connecting the metal plated trench opening surrounding the at least two printed circuits to the metal plated trench opening between the two printed circuits.