Precursor compositions for the deposition of electrically conductive features
A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a viscosity of at least about 1000 centipoise and can be deposited by screen printing. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver and/or copper metal for the formation of highly conductive features.
1. A method for the fabrication of a conductive feature on a substrate, comprising the steps of:
(a) providing a precursor composition comprising a metal precursor compound, wherein said precursor composition has a viscosity of at least about 1000 centipoise;
(b) depositing said precursor composition on a substrate; and
(c) heating said precursor composition to a conversion temperature of not greater than about 2000° to form a conductive feature, wherein said conductive feature has a resistivity of not greater than about 10 times the resistivity of the pure bulk metal.
2. A method as recited in claim 1 , wherein said viscosity is at least about 5000 centipoise.
3. A method as recited in claim 1 , wherein said conductive feature has a minimum feature size of not greater than about 100 μm.
4. A method as recited in claim 1 , wherein said metal precursor compound comprises silver.
5. A method as recited in claim 1 , wherein said metal precursor compound is a metal carboxylate compound.
6. A method as recited in claim 1 , wherein said metal precursor compound is a silver halogenocarboxylate precursor compound.
7. A method as recited in claim 1 , wherein said metal precursor compound is silver trifluoroacetate.
8. A method as recited in claim 1 wherein said precursor composition further comprises a crystallization inhibitor.
9. A method as recited in claim 1 , wherein said precursor composition further comprises a vehicle.
10. A method as recited in claim 1 , wherein said precursor composition further comprises metallic particles.
11. A method as recited in claim 1 , wherein said precursor composition further comprises metallic nanoparticles.
12. A method as recited in claim 1 , wherein said deposition step comprises screen printing.
13. A method as recited in claim 1 , wherein said conversion temperature is not greater than about 185° C.
14. A method as recited in claim 1 , wherein said heating step is performed using a laser.
15. A method as recited in claim 1 , wherein said heating step is performed using a furnace.
16. A method as recited in claim 1 , wherein said conductive feature has a resistivity of not greater than about 6 times the pure bulk metal.
17. A method as recited in claim 1 , wherein said conductive feature has a resistivity of not greater than about 4 times the pure bulk metal.
18. A method as recited in claim 1 , wherein said conductive feature has a resistivity of not greater than about 2 times the pure bulk metal.
19. A method as recited in claim 1 , wherein said substrate is selected from the group consisting of polyfluorinated compounds, polyimides, epoxies, polycarbonate, cellulose-based materials, acetate, polyester, polyethylene, polypropylene, polyvinyl chloride, acrylonitrile-butadiene-styrene, flexible fiber board, non-woven polymeric fabric and cloth.
20. A method as recited in claim 1 , wherein said precursor composition further comprises a polymer.
21. A method for the fabrication of a conductive feature on a substrate, said comprising the steps of:
(a) providing a precursor composition comprising an inorganic silver precursor compound and silver particles, wherein said precursor composition has a viscosity of at least about 1000 centipoise;
(b) depositing said precursor composition onto said substrate; and
(c) heating said precursor composition to a conversion temperature of not greater than about 350° C. to form a conductive feature having a resistivity of not greater than about 10 times the resistivity of bulk silver.
22. A method as recited in claim 21 , wherein said conversion temperature is not greater than about 250° C.
23. A method as recited in claim 21 , wherein said conversion temperature is not greater than about 200° C.
24. A method as recited in claim 21 , wherein said conversion temperature is not greater than about 185° C.
25. A method as recited in claim 21 , wherein said inorganic silver precursor compound is selected from the group consisting of silver oxides, silver nitrates, silver oxalates and silver nitrites.
26. A method as recited in claim 21 , wherein said precursor composition further comprises terpineol.
27. A method as recited in claim 21 , wherein said silver particles comprise silver nanoparticles.
28. A method as recited in claim 21 , wherein said silver particles comprises silver flakes.
29. A method as recited in claim 21 , wherein said conductive feature has a resistivity that is not greater than about 6 times the resistivity of bulk silver.
30. A method as recited in claim 21 , wherein said conductive feature has a resistivity that is not greater than about 4 times the resistivity of bulk silver.
31. A method as recited in claim 21 , wherein said substrate is an organic substrate.
32. A method as recited in claim 21 , wherein said substrate is a polymer.
33. A method as recited in claim 21 , wherein said substrate is polyimide.