Process for manufacturing semiconductor device
View Patent ↗A semiconductor device manufacturing process which includes a test process that minimizes the test time for a single wafer, reduces the test cost and improves the throughput. The test system is made up of a wafer which includes plural chips formed with flash memories, a wafer level whole-surface contact device for contact with the whole surface of the wafer, a tester for testing electric characteristics of the wafer, and a BOST board interposed between the tester and the wafer level whole-surface contact device and with chip-by-chip control circuits mounted thereon. Where the test time differs depending on each chip in the wafer, the BOST board controls each test item for each chip so that in a parallel manner for the chips, upon completion of a preceding test, a shift is made to the next test.
1. A process for manufacturing a semiconductor device, comprising the steps of:
making a simultaneous electric contact with a plurality of chips on a wafer; and
testing electric characteristics of the plurality of chips in a parallel manner,
wherein the step of testing electric characteristics comprises sending a test control signal from a test controller to a test circuit interposed between the test controller and the wafer and allowing the plurality of chips, out of a set of chips on the wafer, to undergo an independent test simultaneously by a test circuit which is controlled with the test control signal, and
wherein when the test of the chips to be tested is over, the test of untested chips is conducted by the test circuit.
2. A process for manufacturing a semiconductor device, comprising the steps of:
making a simultaneous electric contact with a plurality of chips on a wafer; and
testing electric characteristics of the plurality of chips in a parallel manner,
wherein the step of testing electric characteristics comprises sending a test control signal from a test controller to a test circuit interposed between the test controller and the wafer and allowing an independent test to be conducted chip by chip simultaneously for each of the chips on the wafer by the test circuit which is controlled with the test control signal, and
wherein after the start of the simultaneous test for each of the chips on the wafer and after a first test, a first chip of the plurality of chips is subjected to a second test different from the first test without waiting for the end of the first test of a second chip of the plurality of chips.
3. The process according to claim 2 , wherein subsequent to the step of testing electric characteristics, the process further comprising the steps of: grinding a surface of the wafer to reduce the thickness of the wafer; dividing the wafer into individual chips; and obtaining chips which have passed the test of electric characteristics as products.
4. A process for manufacturing a semiconductor device, comprising the steps of:
making a simultaneous electric contact with a plurality of chips on a wafer; and
testing electric characteristics of the plurality of chips in a parallel manner,
wherein the step of testing electric characteristics comprises sending a test control signal from a test controller to a test circuit interposed between the test controller and the wafer and allowing an independent test to be conducted chip by chip simultaneously for each of the chips on the wafer by the test circuit which is controlled with the test control signal, and
wherein the test circuit includes: an interface circuit interposed between the test controller and a contact device for electric contact with the chips on the wafer; a CPU for managing the state of progress of a test for each chip on the wafer and for instructing the execution of a test a memory circuit for storing test result data, trimming data, and a fail bit address with respect to each of the chips; a voltage generating circuit for trimming the circuit of each of the chips; a relief circuit for relieving a fail bit of each of the chips; and an acceleration voltage generating circuit for forcibly accelerating a change in electric characteristics of each of the chips.
5. A process for manufacturing a semiconductor device, comprising the steps of:
making a simultaneous electric contact with a plurality of chips on a wafer; and
testing electric characteristics of the plurality of chips in a parallel manner,
wherein the step of testing electric characteristics comprises sending a test control signal from a test controller to a test circuit interposed between the test controller and the wafer and allowing the plurality of chips, out of a set of chips on the wafer, to undergo an independent test simultaneously by a test circuit which is controlled with the test control signal, and
wherein after the start of the simultaneous test for the plurality of chips out of the set of the chips on the wafer and after a first test, a first chip of the plurality of chips is subjected to a second test different from the first test without waiting for the end of the first test of a second chip of the plurality of chips.
6. The process according to claim 5 , wherein subsequent to the step of testing electric characteristics, the process further comprising the steps of: grinding a surface of the wafer to reduce the thickness of the wafer; dividing the wafer into individual chips; and obtaining chips which have passed the test of electric characteristics as products.
7. A process for manufacturing a semiconductor device, comprising the steps of:
making a simultaneous electric contact with a plurality of chips on a wafer; and
testing electric characteristics of the plurality of chips in a parallel manner,
wherein the step of testing electric characteristics comprises sending a test control signal from a test controller to a test circuit interposed between the test controller and the wafer and allowing the plurality of chips, out of a set of chips on the wafer, to undergo an independent test simultaneously by a test circuit which is controlled with the test control signal, and
wherein the test circuit includes: an interface circuit interposed between the test controller and a contact device for electric contact with the chips on the wafer; a CPU for managing the state of progress of a test for each chip undergoing a test on the wafer and for instructing the execution of a test; a memory circuit for storing test result data, trimming data and a fail bit address with respect to each of the chips undergoing a test; a voltage generating circuit for trimming the circuit of each of the chips undergoing a test; a relief circuit for relieving a fail bit of each of the chips undergoing a test; and an acceleration voltage generating circuit for forcibly accelerating a change in electric characteristics of each of the chips undergoing a test.