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App. No. 10/277,057 · Confirmation No. 6544

MOLDING DIE SET AND SEMICONDUCTOR DEVICE FABRICATED USING THE SAME

Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 View Patent ↗ View Publication ↗
⬇ PDF
 Code Description Pages PDF
2002-10-22 TRNA Transmittal of New Application 2 View
2002-10-22 A.PE Preliminary Amendment 58 View
2002-10-22 SPEC Specification 19 View
2002-10-22 CLM Claims 11 View
2002-10-22 ABST Abstract 1 View
2002-10-22 DRW Drawings-only black and white line drawings 13 View
2002-10-22 OATH Oath or Declaration filed 5 View
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Quick Facts
App. No.
10/277,057
Filed
2002-10-22
Granted
2004-06-29
Pub. No.
US20030042625A1
Art Unit
2822
PTA
0 days