IP Library › Granted Patent US 7,262,610
Granted Patent B2
US 7,262,610 · App. 10/279,988 · Granted Aug 28, 2007

Method for manufacturing and testing semiconductor devices on a resin-coated wafer

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Quick Facts
Patent No.
US 7,262,610
App. No.
10/279,988
Granted
Aug 28, 2007
Kind
B2
Abstract

A semiconductor device test apparatus according to the present invention includes a circuit board 103 and a film 105. A plurality of electrodes 103 c are formed at the circuit board 103 at positions that face opposite a plurality of electrodes 201 a at a device to be measured 201, whereas bumps 105 b are formed at the surface of the film 105 located toward the device to be measured 201, at positions that face opposite the plurality of electrodes 201 a at the device to be measured 201 and electrodes 105 c are formed at the surface of the film 105 located toward the circuit board 103 at positions that face opposite the plurality of electrodes 103 c at the circuit board 103 . The bumps 105 b formed at one surface of the film 105 and the electrodes 105 c formed at another surface of the film 105 are electrically connected with each other via through holes 105 d to support semiconductor devices having electrodes provided at a fine pitch and to improve durability.

Claims (41)

1. A method for manufacturing semiconductor devices, the method comprising:

providing a semiconductor wafer with a wafer surface having a plurality of circuit elements formed thereon;

forming on the wafer surface a plurality of electrodes connected with the circuit elements;

coating substantially the whole wafer surface with a resin so as to leave exposed the electrodes, said resin forming an outer layer;

inserting the resin-coated wafer into a burn-in apparatus;

testing the circuit elements for electrical functions in the burn-in apparatus through the electrodes; and

forming a plurality of packaged semiconductor devices by dividing the wafer after said step of coating said wafer with said outer layer.

2. A method according to claim 1 , wherein said dividing includes dividing the resin-coated wafer into the plurality of semiconductor devices after said testing.

3. A method according to claim 2 , further comprising:

mounting the resin-coated wafer on a circuit board by interposing an elastic sheet between the resin-coated wafer and the circuit board, including electrically connecting wiring circuits on the circuit board to the plurality of electrodes with conductive elastic portions of elastic sheet.

4. A method according to claim 3 , further comprising:

providing over the resin-coated wafer a holding plate having a through hole; and

pressing the resin-coated wafer on the circuit board with the holding plate.

5. A method according to claim 2 , further comprising:

mounting the resin-coated wafer on a circuit board by interposing between the resin-coated wafer and the circuit board a film having bump electrodes, such that the bump electrodes electrically connect wiring circuits on the circuit board with the plurality of electrodes.

6. A method for manufacturing semiconductor devices, the method comprising:

providing a semiconductor wafer having a first surface and a second surface, the first surface being opposite to the second surface, wherein the first surface has a plurality of circuit elements formed thereon;

forming a plurality of electrodes on the first surface, the electrodes being connected with the circuit elements;

coating substantially the whole first surface of the wafer with a resin so as to leave exposed the electrodes through the resin, said resin forming an outer layer;

inserting the wafer into a burn-in apparatus with the first surface coated with the resin;

testing the circuit elements for electrical functions in the burn-in apparatus through the electrodes; and

forming a plurality of packaged semiconductor devices by dividing the wafer after said step of coating said wafer with said outer layer.

7. A method according to claim 6 , wherein said dividing includes dividing the resin-coated wafer into the plurality of semiconductor devices after said testing.

8. A method according to claim 7 , further comprising:

mounting the resin-coated wafer on a circuit board by interposing an elastic sheet between the resin-coated wafer and the circuit board, including electrically connecting wiring circuits on the circuit board to the plurality of electrodes with conductive elastic portions of elastic sheet.

9. A method according to claim 8 , further comprising:

providing over the resin-coated wafer a holding plate having a through hole; and

pressing the resin-coated wafer on the circuit board with the holding plate.

10. A method according to claim 7 , further comprising:

mounting the resin-coated wafer on a circuit board by interposing between the resin-coated wafer and the circuit board a film having bump electrodes, such that the bump electrodes electrically connect wiring circuits on the circuit board with the plurality of electrodes.

11. A method of manufacturing semiconductor devices comprising:

Providing a semiconductor wafer having a plurality of electrodes on a surface thereof, the surface of the semiconductor substrate being covered by a resin forming an outer layer so that only the electrodes are exposed from the resin;

Subjecting the resin covered wafer to a burn-in process;

Testing the resin covered wafer during the burn-in process; and

Forming a plurality of packaged semiconductor devices by dividing the tested wafer after covering said wafer with said resin forming said outer layer.

12. A method of manufacturing semiconductor devices according to claim 10 , wherein the resin covered wafer is mounted on a circuit board during the burn-in process.

13. A method of manufacturing semiconductor devices according to claim 11 , wherein the resin covered wafer is mounted on the circuit board via an elastic sheet.

14. A method of manufacturing semiconductor devices according to claim 11 , wherein the resin covered wafer is mounted on the circuit board via a film.

15. A method of manufacturing semiconductor devices according to claim 11 , wherein the resin covered wafer and the circuit board are fixed by a positioning plate.

16. A method of manufacturing semiconductor devices according to claim 14 , wherein the resin covered wafer is fixed by a holding plate.

17. A method of manufacturing semiconductor devices according to claim 10 , wherein each of the packaged semiconductor devices has the electrodes.