Pressure-welded structure of flexible circuit boards
View Patent ↗A pressure-welded structure of flexible circuit boards in a liquid crystal display device having a group of lead terminals of flexible circuit boards connected with a plurality of terminals aligned on an end surface of a TFT glass substrate via anisotropic conductive films. A resin is applied on a surface opposite to the terminal surface of the flexible circuit boards, and an end portion of the resin is 0.1 to 10 mm away from an end portion of a resin applied on the terminal surface of the flexible circuit boards, thereby both resins applied on the terminal surface and on the other surface overlap each other by 0.1 to 10 mm. It is possible to improve not only the yield in module assembly but also the quality and reliability of the product.
1. A pressure-welded structure of flexible circuit boards in a liquid crystal display device having lead terminals of flexible circuit boards each having a terminal surface connected with a plurality of terminals aligned on an end surface of a TFT glass substrate via anisotropic conductive films, wherein
a stiffening layer of resin having a substantially uniform thickness is applied on a surface opposite to the terminal surface of each flexible circuit board, and
an end portion of the resin is 0.1 to 10 mm away from an end portion of a resin applied on the terminal surface of each flexible circuit board,
whereby the respective resins applied on the terminal surface and on the other surface overlap each other by 0.1 to 10 mm and
wherein the resin applied on the surface opposite to the terminal surface is about 40 percent thicker than the resin applied to the terminal surface.
2. The pressure-welded structure of claim 1 , wherein the resin applied on the terminal surface is about 25 μm thick and the resin applied on the surface opposite to the terminal surface is a resin layer about 35 μm thick.
3. A pressure-welded structure of flexible circuit boards in a liquid crystal display device having lead terminals of flexible circuit boards each having a terminal surface connected with a plurality of terminals aligned on a surface of a printed circuit board via an anisotropic conductive film, wherein
a stiffening layer of resin having a substantially uniform thickness is applied on a surface opposite to the terminal surface of each flexible circuit board, and
an end portion of the resin is 0.1 to 10 mm away from the end portion of a resin applied on the terminal surface,
whereby the respective resins applied on the terminal surface and on the opposite surface overlap each other b 0.1 to 10 mm, and
wherein the resin applied on the surface opposite to the terminal surface is about 40 percent thicker than the resin applied to the terminal surface.
4. The pressure-welded structure of claim 3 , wherein the resin applied on the terminal surface is about 25 μm thick and the resin applied on the surface opposite to the terminal surface is a resin layer about 35 μm thick.