Ball grid array package with separated stiffener layer

1. A ball grid array (BGA) package, comprising:

a substantially planar substrate that has a plurality of contact pads on a first surface of said substrate that are electrically connected through said substrate to a plurality of solder ball pads on a second surface of said substrate;

a substantially planar first stiffener attached to said first surface of said substrate;

a substantially planar second stiffener attached to said first surface of said substrate to be co-planar with said first stiffener, said second stiffener being separated from said first stiffener by a channel therebetween; and

an integrated circuit (IC) die mounted to a surface of said second stiffener.

2. The package of claim 1 , wherein said first stiffener, said second stiffener, and said channel form a substantially rectangular shape.

3. The package of claim 2 , wherein a single stiffener piece is split to form the first stiffener, the second stiffener, and the channel.

4. The package of claim 1 , further comprising:

a plurality of solder balls attached to said plurality of solder ball pads.

5. The package of claim 1 , further comprising:

a wire bond that couples a bond pad of said IC die to a surface of said first stiffener.

6. The package of claim 5 , further comprising:

a second wire bond that couples a second bond pad of said IC die to the surface of said second stiffener.

7. The package of claim 1 , further comprising:

a wire bond that couples a bond pad of said IC die to the surface of said second stiffener.

8. The package of claim 1 , wherein said first stiffener has an opening that is open at a first surface and a second surface of said first stiffener.

9. The package of claim 8 , further comprising:

a wire bond that couples a bond pad of said IC die to a contact pad on said first surface of said substrate through said opening.

10. The package of claim 1 , wherein said second stiffener has an opening that is open at a first surface and a second surface of said second stiffener.

11. The package of claim 10 , further comprising:

a wire bond that couples a bond pad of said IC die to a contact pad on said first surface of said substrate through said opening.

12. The package of claim 1 , wherein said channel has a first width in a first portion of said channel, and said channel has a second width in a second portion of said channel.

13. The package of claim 12 , wherein said second width allows for at least one wire bond to be coupled between a bond pad of said IC die and a contact pad on said first surface of said substrate through said second portion of said channel.

14. The package of claim 1 , wherein said second stiffener has an opening that is open at a first surface and a second surface of said second stiffener and wherein said opening has an edge that is proximate to said channel.

15. The package of claim 14 , further comprising:

a wire bond that couples a bond pad of said IC die to a contact pad on said first surface of said substrate through said opening.

16. The package of claim 1 , wherein at least one of said first stiffener and said second stiffener includes at least one metal.

17. The package of claim 16 , wherein said at least one metal includes copper.

18. The package of claim 16 , wherein said at least one metal includes aluminum.

19. The package of claim 16 , wherein said at least one metal is an alloy.

20. The package of claim 1 , wherein at least one of said first stiffener and said second stiffener includes a ceramic.

21. The package of claim 1 , wherein at least one of said first stiffener and said second stiffener includes an organic material.

22. The package of claim 1 , wherein at least one of said first stiffener and said second stiffener includes a plastic.