Granted Patent B2

US 6,877,992 · App. 10/285,777 · Granted Apr 12, 2005

Abstract

Claims (27)

1. An area array connector adapted to connect contact pads on a first generally planar circuit element to corresponding contact pads on a second generally planar circuit element, the area array connector comprising:

an interposer housing; and

at least one electrical interconnector positioned within the interposer housing, the at least one electrical interconnector comprised of a plurality of electrical contacts stacked in a substantially parallel relationship to one another, the at least one electrical interconnector positioned to make contact with a first contact pad on the first generally planar circuit element and a second contact pad on the second generally planar circuit element to provide an electrical interconnection therebetween.

2. The area array connector of claim 1 , wherein the at least one electrical interconnector is a power interconnector.

3. The area array connector of claim 1 , further comprising:

at least one signal interconnector positioned within the interposer housing, the at least one signal interconnector positioned to make contact with a first signal contact pad on the first generally planar circuit element and a second signal contact pad on the second generally planar circuit element to provide an electrical interconnection therebetween.

4. The area array connector of claim 1 , wherein the interposer housing comprises at least one insulative layer.

5. The area array connector of claim 4 , wherein the at least one insulative layer comprises a plurality of laminated layers.

6. The area array connector of claim 1 , wherein the interposer housing comprises a first molded housing half and a second molded housing half.

7. The area array connector of claim 1 , wherein at least one of the first generally planar circuit element and the second generally planar circuit element comprises a circuit card.

8. The area array connector of claim 1 , wherein at least one of the first generally planar circuit element and the second generally planar circuit element comprises a printed circuit board.

9. The area array connector of claim 1 , wherein at least one of the first generally planar circuit element and the second generally planar circuit element comprises an integrated circuit.

10. The area array connector of claim 1 , wherein at least one of the first generally planar circuit element and the second generally planar circuit element comprises a multichip module.

11. An assembly comprising:

a plurality of generally planar circuit elements having contact elements on at least one surface thereof; and

at least one area array connector, the circuit elements being stacked upon one another with the at least one area array connector interleaved therebetween, the at least one area array connector comprising:

an interposer housing; and

at least one electrical interconnector positioned within the interposer housing, the at least one electrical interconnector comprised of a plurality of electrical contacts stacked in a substantially parallel relationship to one another, the electrical interconnector positioned to make contact with a first contact pad on one of the plurality of generally planar circuit elements and a second contact pad on another of the plurality of generally planar circuit elements to provide an electrical interconnection therebetween.

12. The assembly of claim 11 , wherein the at least one electrical interconnector is a power interconnector.

13. The assembly of claim 11 , wherein the at least one area array connector further comprises at least one signal interconnector positioned within the interposer housing, the at least one signal interconnector positioned to make contact with a first signal contact pad on one of the plurality of generally planar circuit element and a second signal contact pad on another of the plurality of generally planar circuit elements to provide an electrical interconnection therebetween.

14. The assembly of claim 11 , wherein the interposer housing comprises at least one insulative layer.

15. The assembly of claim 14 , wherein the at least one insulative layer comprises a plurality of laminated layers.

16. The assembly of claim 11 , wherein the interposer housing comprises a first molded housing half and a second molded housing half.

17. The assembly of claim 11 , wherein at least one of the plurality of generally planar circuit elements comprises a circuit card.

18. The assembly of claim 11 , wherein at least one of the plurality of generally planar circuit elements comprises a printed circuit board.

19. The assembly of claim 11 , wherein at least one of the plurality of generally planar circuit elements comprises an integrated circuit.

20. The assembly of claim 11 , wherein at least one of the plurality of generally planar circuit elements comprises a multichip module.

Assignments (10)