Method for fabricating an inorganic resistor
Precursor compositions for the fabrication of electronic features such as resistors and capacitors. The precursor compositions are formulated to have a low conversion temperature, such as not greater than about 350° C., thereby enabling the fabrication of such electronic features on a variety of substrates, including organic substrates such as polymer substrates.
1. A method for fabricating an inorganic resistor on an organic substrate, comprising the steps of:
a) applying a flowable precursor composition to an organic substrate wherein said precursor composition comprises a molecular precursor to a conductive phase and particles of an insulating material;
b) heating said substrate to a temperature of not greater than about 350° C. to convert said molecular precursor to said conductive phase and form a resistor wherein said resistor has a resistivity of at least about 100 μΩ-cm.
2. A method as recited in claim 1 , wherein said heating step comprises heating to a temperature of not greater than about 300° C.
3. A method as recited in claim 1 , wherein said heating step comprises heating to a temperature of not greater than about 250° C.
4. A method as recited in claim 1 , wherein said heating step comprises heating to a temperature of not greater than about 200° C.
5. A method as recited in claim 1 , wherein said heating step comprises heating to a temperature of not greater than about 150° C.
6. A method as recited in claim 1 , wherein said molecular precursor comprises silver metal.
7. A method as recited in claim 1 , wherein said molecular precursor comprises a metal selected from the group consisting of silver, copper and nickel.
8. A method as recited in claim 1 , wherein said insulating material is selected from the group consisting of silica, alumina, titania and a glass.
9. A method as recited in claim 1 , wherein said insulating material particles have an average particle size of not greater than about 100 nanometers.
10. A method as he said in claim 1 , wherein said step of applying a flowable precursor composition comprises depositing said a flowable precursor composition using a syringe.
11. In method as recited in claim 1 , wherein said substrate is a polyimide substrate.
12. A method as recited in claim 1 , wherein said precursor composition has a viscosity of at least about 10,000 centipoise.
13. A method as recited in claim 1 , wherein said resistor has a resistivity of at least about 1000 μΩ-cm.
14. A method as recited in claim 1 , wherein said resistor has a resistivity of at least about 10,000 μΩ-cm.
15. A method as recited in claim 1 , wherein said resistor has a resistivity of at least about 100,000 μΩ-cm.
16. A method as recited in claim 1 , wherein said resistor is a component of a circuit comprising organic transistors.
17. A method as recited in claim 1 , wherein said resistor is a component of a display backplane.
18. A method as recited in claim 1 , wherein said resistor is a component of a circuit board.
19. A method as recited in claim 1 , wherein said resistor is a component of an RF tag.
20. A method as recited in claim 1 , wherein said resistor is a component of a smart card.