Granted Patent
Utility
US 6,653,218
· Confirmation No. 6130
METHOD OF FABRICATING RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2003-09-15 | IFEE |
Issue Fee Payment (PTO-85B) | 1 | View | |
| 2002-11-05 | TRNA |
Transmittal of New Application | 1 | View | |
| 2002-11-05 | A.PE |
Preliminary Amendment | 9 | View | |
| 2002-11-05 | SPEC |
Specification | 12 | View | |
| 2002-11-05 | CLM |
Claims | 3 | View | |
| 2002-11-05 | ABST |
Abstract | 1 | View | |
| 2002-11-05 | DRW |
Drawings-only black and white line drawings | 7 | View | |
| 2002-11-05 | OATH |
Oath or Declaration filed | 3 | View |
Inventors
Attorneys & Agents of Record
Classification
USPC
438/613
H10W72/20
H10P54/00
H10W74/137
H10W72/221
H10W20/063
H10W72/01255
H10W72/923
H10W72/01331
H10W72/952
H10W72/242
H10W72/0198
H10W72/29
H10W72/019
H10W72/9415
H10W70/60
H10W72/252
Prosecution
- Examiner
- PHAM, HOAI V
- Art Unit
- 2814
- Docket No.
- OKI 231D1
- Confirmation No.
- 6130
Foreign Priority
098589/99
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1999-04-06
·
JAPAN
Publication
- Pub. No.
- US20030071352A1
- Pub. Date
- 2003-04-17
Patent Term Adjustment
0days
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Quick Facts
- Patent No.
- US 6,653,218
- App. No.
- 10/287,532
- Filed
- 2002-11-05
- Granted
- 2003-11-25
- Pub. No.
- US20030071352A1
- Examiner
- PHAM, HOAI V
- Art Unit
- 2814
- PTA
- 0 days
External Links