High speed optical transceiver package using heterogeneous integration
View Patent ↗The invention includes an opto-electronic device with a device region having a bottom surface and a top surface, and a top emitting/illumination window, an isolation region, wherein the isolation region electrically isolates the device region, a superstrate having a bottom surface and a top surface, wherein the bottom surface is positioned upon the top surface of the device region, a micro-optical device positioned upon the top surface of the superstrate. The invention also includes a method of fabricating an opto-electronic device having the steps of forming a device region with a top surface and a bottom surface upon a substrate, forming an isolation region, wherein the isolation region surrounds the device region, forming a superstrate upon the top surface of the device region, integrating a micro-optical device on the top surface of the device region, and bonding an integrated circuit to the bottom surface of the device region.
1. An opto-electronic device comprising:
a device region having a bottom surface and a top surface, and a top emitting/illumination window;
an isolation region, wherein the isolation region electrically isolates the device region;
a superstrate having a bottom surface and a top surface, wherein the bottom surface is positioned adjacent the top surface of the device region;
a micro-optical device positioned adjacent the top surface of the superstrate.
2. The opto-electronic device of claim 1 , wherein said device region is a vertical cavity surface emitting laser or a p-n photodetector.
3. The opto-electronic device of claim 1 , wherein said isolation region comprises an area of ion implantation.
4. The opto-electronic device of claim 3 , wherein said isolation region is formed by ion implantation from the top surface of the device region and the bottom surface of the device region.
5. The opto-electronic device of claim 1 , wherein said superstrate is optically transparent.
6. The opto-electronic device of claim 1 , wherein said micro-optical device is a collimating lens, a focusing lens, or a refractive lens.
7. The opto-electronic device of claim 1 , further comprising an integrated circuit adjacent to the bottom surface of said device region.
8. The opto-electronic device of claim 1 , wherein said isolation regions are adjacent to said device region.
9. The opto-electronic device of claim 1 , wherein said micro-optical device is positioned on top of said device region.
10. An opto-electronic device comprising:
a device region having a bottom surface and a top surface, and a top emitting/illumination window;
an isolation region, wherein the isolation region electrically isolates the device
region, and wherein said isolation region is formed by ion implantation from said top surface of the device region and said bottom surface of the device region;
a superstrate having a bottom surface and a top surface, wherein the bottom surface is positioned adjacent the top surface of the device region;
a micro-optical device positioned adjacent the top surface of the superstrate; and an integrated circuit adjacent to the bottom surface of said device region.
11. The opto-electronic device of claim 8 , wherein said device region is a vertical cavity surface emitting laser or a p-n photodetector.
12. The opto-electronic device of claim 9 , wherein said superstrate is optically transparent.
13. The opto-electronic device of claim 8 , wherein said isolation regions are adjacent to said device region.
14. The opto-electronic device of claim 8 , wherein said micro-optical device is positioned on top of said device region.