High frequency antenna disposed on the surface of a three dimensional substrate
View Patent ↗The present invention consists of an electrical communications device including a three-dimensional substrate and a plurality of electrical devices attached thereto. The substrate is preferably a dielectric. The electrical device is preferably of the sort needed to conduct high frequency communications, such as a microwave antenna and photonic receivers and transmitters. The electrical devices are attached to the substrate at the connection points described by the intersection of a series vias and one of the substrate surfaces. The electrical devices are attached to the substrate in numerous ways, including solder, flipped chip ball bonds, wire bonds, or a gold stud assembly. In particular, the gold stud assembly is utilized to attach the antenna to the substrate, thereby providing a predetermined air gap therebetween.
1. An electrical communications apparatus comprising:
a dielectric material defining a volume, the dielectric material further defining a first planar surface, a second planar surface, and a third planar surface;
at least two vias inscribed within the dielectric material, the at least two vias intersecting at least two of the first planar surface, the second planar surface, and the third planar surface and thereby providing a plurality of intersection points on the at least two of the first planar surface, the second planar surface, and the third planar surface;
wherein the first planar surface, the second planar surface, and the third planar surface intersect along a first line, a second line, and a third line respectively, and further wherein the first line, the second line, and the third line are mutually perpendicular; and
wherein the at least two vies are electrically conductive, and further wherein a GaAs antenna is in communication with at least one electrical device through the at least two vias.
2. The electrical communications apparatus of claim 1 wherein the GaAs antenna is connected to the dielectric material by a gold stud assembly.
3. The electrical communications apparatus of claim 2 wherein the gold stud assembly is of a predetermined length such that the GaAs antenna is distanced from the dielectric material by an air gap.
4. An electrical communications apparatus comprising:
a dielectric material defining a volume, the dielectric material further defining a first planar surface, a second planar surface, and a third planar surface;
at least two via inscribed within the dielectric material, the at least two vias intersecting at least two of the first planar surface, the second planar surface, and the third planar surface and thereby providing a plurality of intersection points on the at least two of the first planar surface, the second planar surface, and the third planar surface;
wherein the first planar surface, the second planar surface, and the third planar surface intersect along a first line, a second line, and a third line respectively, and further wherein the first line, the second line, and the third line are mutually perpendicular;
wherein the at least two vias are electrically conductive, and further wherein an antenna is in communication with at least one electrical device through the at least two vias; and
wherein the at least one electrical device includes an optical communications cluster including optical communication electrical devices.
5. The electrical communications apparatus of claim 4 wherein the optical communications cluster includes at least a CMOS controller, a pin diode, and a vertical cavity surface emitting laser.
6. The electrical communications device of claim 4 wherein the optical communications cluster is adapted to receive a set of optical signals from a central controller, process the set of optical signals, and transmit a set of reply signals to the central controller.