Patent Application
Utility
App. No. 10/298,616
· Confirmation No. 4019
Organic copper diffusion barrier layer
Inventor:
Shyh-Dar Lee
Abandoned -- Failure to Respond to an Office Action
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2002-11-19 | TRNA |
Transmittal of New Application | 3 | View | |
| 2002-11-19 | A.PE |
Preliminary Amendment | 5 | View | |
| 2002-11-19 | SPEC |
Specification | 10 | View | |
| 2002-11-19 | CLM |
Claims | 4 | View | |
| 2002-11-19 | ABST |
Abstract | 1 | View | |
| 2002-11-19 | DRW |
Drawings-only black and white line drawings | 3 | View | |
| 2002-11-19 | OATH |
Oath or Declaration filed | 2 | View |
Inventors
Shyh-Dar Lee
Hsinchu, TAIWAN
Attorneys & Agents of Record
Classification
USPC
438/687
H10W20/077
H10W20/084
Prosecution
- Examiner
- THOMPSON, CRAIG
- Art Unit
- 2813
- Docket No.
- 4006-129A
- Confirmation No.
- 4019
Publication
- Pub. No.
- US20030067077A1
- Pub. Date
- 2003-04-10
No recorded assignments were found for this patent.
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Quick Facts
- App. No.
- 10/298,616
- Filed
- 2002-11-19
- Pub. No.
- US20030067077A1
- Examiner
- THOMPSON, CRAIG
- Art Unit
- 2813
External Links