IP Library Granted Patent US 6,900,773
Granted Patent B2
US 6,900,773 · App. 10/298,870 · Granted May 31, 2005

Active configurable capacitively loaded magnetic diploe

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Quick Facts
Patent No.
US 6,900,773
App. No.
10/298,870
Granted
May 31, 2005
Kind
B2
Abstract

A capacitively coupled dipole antenna is provided with one or more active control elements. The active control elements may be used to effectuate changes in the operating characteristics of the antenna.

Claims (36)

1. A device, comprising:

a ground plane, the ground plane comprising a first side and a second side;

a first capacitively loaded dipole antenna;

a second capacitively loaded dipole antenna, wherein the first antenna is coupled to a first side of the ground plane, and wherein the second antenna is coupled to a second side of the ground plane;

a first active component, the first active component comprising a first control input, wherein an input to the first control input enables characteristics of the first antenna to be configured; and

a second active component, the second active component comprising a second control input, wherein an input to the second control input enables characteristics of the second antenna to be configured.

2. The device of claim 1 , wherein the first capacitively loaded dipole antenna further comprises a plurality of portions and wherein the first active component in coupled to one or more of the plurality of portions.

3. The device of claim 2 , wherein one or more of the plurality of portions device a capacitive area and wherein the first active component is disposed generally in the capacitive area.

4. The device of claim 2 , wherein one or more of the plurality of portions define an inductive area, and wherein the first active component is disposed generally in the inductive area.

5. The device of claim 2 , wherein one or more of the plurality of portions define a feed area, and wherein the first active component is disposed generally in the feed area.

6. The device of claim 2 , wherein the plurality of portions further comprising a top portion, a middle portion, and a bottom portion, wherein the top portion is coupled to the bottom portion, the bottom portion is coupled to the middle portion, and the middle portion is disposed generally between the top portion and the bottom portion.

7. The device of claim 6 , wherein the top portion and the middle portion generally define a capacitve area, wherein the middle portion and the bottom portion generally define an inductive area.

8. The device of claim 7 , wherein the first active component is disposed in the capacitive area.

9. The device of claim 7 , wherein the first active component is disposed in the inductive area.

10. The device of claim 7 , wherein the first active component is coupled to the top portion and the middle portion.

11. The device of claim 7 , wherein the first active component is coupled to the middle portion and the bottom portion.

12. The device of claim 7 , wherein the first active component is disposed to couple to the top portion to the bottom portion.

13. The device of claim 7 , wherein the first active component is disposed to couple the bottom portion to the middle portion.

14. The device of claim 1 , wherein the first active component further comprises a switch.

15. The device of claim 1 , wherein the first active component further exhibits active capacitive or inductive characteristics.

16. The device of claim 1 , wherein the first active component further comprises an FET device.

17. The device of claim 1 , wherein the first active component further comprises a MEMs device.

18. The device of claim 1 , wherein the device further comprises a wireless communication device, a feed, and a ground, wherein the wireless communications device is coupled to the first capacitively loaded dipole antenna through the feed and the ground.

19. The device of claim 1 , wherein the device further comprises a wireless communication device, a feed, and a ground, wherein the wireless communications device is coupled to the second capacitively loaded dipole antenna through the feed and the ground.

20. The device of claim 1 , wherein the first capacitively loaded dipole antenna further comprises:

a ground plane;

a first conductor having a first length extending generally longitudinally above the ground plane and having a first end electrically connected to the ground plane at a first location;

a second conductor having a second length extending generally longitudinally above the ground plane, the second conductor having a first end electrically connected to the ground plane at a second location; and

an antenna feed coupled to the first conductor.

21. The device of claim 20 , wherein the first and second conductors overlap in an area to form a gap, wherein the first active component is disposed in the gap.

22. The device of claim 20 , wherein the first conductor or the second conductor comprise the first active component.

23. The device of claim 20 , wherein the first active component is disposed between the second conductor and the ground plane.

24. The device of claim 20 , wherein the first active component is disposed between the antenna feed and the ground plane.

25. The device of claim 20 , further comprising a first stub coupled to the antenna feed.

26. The device of claim 25 , wherein the first stub comprises the first active component.

27. The device of claim 25 , further comprising a second stub and a third active component, wherein the first stub comprises the first active component, and the third active component is coupled between the second stub and the ground plane.

Assignments (8)
CHANGE OF NAME Recorded May 5, 2023
From: ETHERTRONICS, INC.
To: AVX ANTENNA, INC.
Reel/Frame 063549/0336 →
CHANGE OF NAME Recorded May 4, 2023
From: AVX ANTENNA, INC.
To: KYOCERA AVX COMPONENTS (SAN DIEGO), INC.
Reel/Frame 063543/0302 →
RELEASE OF SECURITY INTEREST Recorded Jan 31, 2018
From: NH EXPANSION CREDIT FUND HOLDINGS LP
To: ETHERTRONICS, INC.
Reel/Frame 045210/0725 →
RELEASE OF SECURITY INTEREST Recorded Nov 15, 2016
From: SILICON VALLEY BANK; GOLD HILL CAPITAL 2008, LP
To: ETHERTRONICS, INC.
Reel/Frame 040331/0919 →
SECURITY INTEREST Recorded Oct 21, 2016
From: ETHERTRONICS, INC.
To: NH EXPANSION CREDIT FUND HOLDINGS LP
Reel/Frame 040464/0245 →
SECURITY AGREEMENT Recorded Mar 29, 2013
From: ETHERTRONICS, INC.
To: GOLD HILL CAPITAL 2008, LP; SILICON VALLY BANK
Reel/Frame 030112/0223 →
SECURITY AGREEMENT Recorded Sep 11, 2008
From: ETHERTRONICS, INC.
To: SILICON VALLEY BANK
Reel/Frame 021511/0303 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 18, 2002
From: POILASNE, GREGORY; DESCLOS, LAURENT; ROWSON, SEBASTIAN
To: ETHERTRONICS, INC.
Reel/Frame 013505/0063 →