Method for making a financial transaction card with embedded electronic circuitry
View Patent ↗Financial transaction and similar cards are fabricated with a split core adapted to received embedded electronic circuitry. The card core has two or more laminated layers. The cavity is milled into one or more of the layers to receive the electronic circuitry. The core layers are then laminated together, along with protective overlays. Alternative fabrication methods include co-extrusion and injection molding.
1. A method of constructing a card with embedded electronic circuitry comprising:
printing first card graphics on a first surface of a first core member;
printing second card graphics on a first surface of a second core member;
laminating a first overlay to the first surface of the first core member;
laminating a second overlay to the first surface of the second core member;
milling a cavity in a second surface of the first core member after the first overlay has been laminated to the first surface of the first core member;
installing electronic components in the cavity;
aligning the second surface of the first core member with a second surface of the second core member;
laminating together the first and second core members.
2. The method of claim 1 wherein the first and second core members are laminated together using a cold lamination process.
3. The method of claim 1 wherein the first core member comprises a plurality of layers of material laminated together.
4. The method of claim 3 further comprising reducing the thickness of the laminated first core member and first overlay after the electronic components are installed in the cavity.
5. The method of claim 1 wherein installing electronic components in the cavity includes filling the cavity with a curable resin.
6. The method of claim 1 wherein each of the first and second core members and first and second overlays are made of a transparent material.
7. The method of claim 6 further comprising forming a magnifying lens in a portion of the card.
8. The method of claim 1 wherein the electronic components comprise a battery.
9. The method of claim 1 wherein the electronic components comprise a switch.
10. The method of claim 1 wherein the electronic components comprise an LED.