IP Library Granted Patent US 6,954,033
Granted Patent B2
US 6,954,033 · App. 10/302,666 · Granted Oct 11, 2005

Plasma processing apparatus

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Quick Facts
Patent No.
US 6,954,033
App. No.
10/302,666
Granted
Oct 11, 2005
Kind
B2
Abstract

A plasma processing apparatus of the present invention includes a matching circuit for impedance matching between a radio-frequency generator and a plasma processing chamber, and one or a plurality of impedance converting circuits provided between the matching circuit and the radio-frequency generator. The impedance converting circuit converts an impedance to decrease a difference in impedance to be matched by the matching circuit, thereby decreasing a change in the output impedance with a moving amount of a capacitance control of one of variable passive elements of the matching circuit, such as a load capacitor and a tuning capacitor. Therefore, a change in the impedance of the plasma processing chamber can be finely controlled.

Claims (21)

1. A plasma processing apparatus comprising:

a radio-frequency generator;

a plasma processing chamber,

matching moans for performing impedance matching between the radio frequency generator and the plasma processing chamber; and

one or a plurality of impedance converting means provided between the matching means and the radio-frequency generator,

wherein the impedance converting means includes a capacitor and an inductor which reduce an impedance difference between an output impedance of the radio-frequency generator, and an input impedance of the matching means.

2. A plasma processing apparatus according to claim 1 , wherein the one or plurality of impedance converting means converts an output impedance to a value close to the impedance of the plasma processing chamber between the output impedance of the radio-frequency generator and the impedance of the chamber.

3. A plasma processing apparatus according to claim 1 , wherein the one or plurality of impedance converting means converts an output impedance to a value close to the impedance of the plasma processing chamber between the output impedance of the radio-frequency generator and the impedance of the chamber.

4. A plasma processing apparatus according to claim 1 , wherein the one plurality of impedance converting means converts the impedance from 50 Ω to 10 Ω or less.

5. A plasma processing apparatus comprising

a radio-frequency generator;

a plasma processing chamber;

matching circuitry for performing impedance matching between the radio frequency generator and the plasma processing chamber; and

at least one impedance converting circuit provided between the matching circuit and the radio-frequency generator,

wherein the impedance converting means includes a capacitor and an inductor which reduce an impedance difference between an output impedance of the radio-frequency generator, and an input impedance of the matching means.

6. A plasma processing apparatus according to claim 5 , wherein the impedance converting circuit comprises at least one inductor and at least one capacitor.

7. A plasma processing apparatus according to claim 6 , wherein the at least one capacitor and at least one inductor have fixed values.

8. A plasma processing apparatus according to claim 5 , wherein the impedance converting circuit provides matching between the output impedance of a characteristic impedance of a coaxial cable connected to the radio frequency generator and the impedance of the plasma processing chamber.

9. A plasma processing apparatus according to claim 5 , wherein the at least one impedance converting circuit converts an output impedance to a value close to the impedance of the plasma processing chamber between the output impedance of the radio-frequency generator and the impedance of the chamber.

10. A plasma processing apparatus according to claim 5 , wherein the at least one impedance converting circuit converts an output impedance to value close to the impedance of the plasma processing chamber between the output impedance of the radio-frequency generator and the impedance of the chamber.

11. A plasma processing apparatus according to claim 5 , wherein the at least one impedance converting circuit converts the impedance from 50 Ω to 10 Ω or less.

Assignments (2)
CHANGE OF NAME Recorded Jan 31, 2019
From: ALPS ELECTRIC CO., LTD.
To: ALPS ALPINE CO., LTD.
Reel/Frame 048200/0139 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 21, 2002
From: NAKANO, AKIRA; KUMAGAI, TADASHI; OHMI, TADAHIRO
To: ALPS ELECTRONICS CO., LTD.; TADAHIRO OHMI
Reel/Frame 013522/0064 →