Method of manufacturing surface acoustic wave device
View Patent ↗Disclosed is a method of manufacturing a surface acoustic wave device comprising the steps of forming a drive electrode having a surface acoustic wave element function on a piezoelectric substrate wafer, providing a resist coat on an upper region of the drive electrode, covering the resist coat with a metal film, removing the resist coat lying within the metal film so that the metal film is formed in a dome form having a hollow portion covering the drive electrode, and providing a resin seal on the metal film.
1. A method of manufacturing a surface acoustic wave device, comprising the steps of:
forming a drive electrode having a surface acoustic wave element function and an external connection unit on a piezoelectric substrate wafer;
providing a resist coat on an upper region of the drive electrode;
covering the resist coat with a metal film;
providing an electro-conductive column on the external connection unit;
removing the resist coat lying within the metal film so that the metal film is formed in a dome form having a hollow portion covering the drive electrode;
forming an external connection terminal at an extremity of the electro-conductive column; and
providing a resin seal on the metal film.
2. The method of manufacturing a surface acoustic wave device according to claim 1 , wherein the resin seal is provided by a first sealing step with a resin having high hardening speed and high viscosity and by a second sealing step with a resin having lower hardening speed and lower viscosity than the resin for use in the first sealing step.
3. The method of manufacturing a surface acoustic wave device according to claim 2 , wherein the resin for use in the resin seal is epoxy resin.
4. The method of manufacturing a surface acoustic wave device according to claim 2 , wherein the resin for use in the resin seal is polyimide resin.