High-power multi-device liquid cooling
View Patent ↗A cooling system is presented. The system includes a cooling circuit and at least one electronic component coupled to a surface. One or more heat dissipation structures are in thermal contact with the at least one electronic component. At least one sliding seal mechanism is coupled to the cooling circuit and the one or more heat dissipation structures so as to provide fluid communication between the cooling circuit and the one or more heat dissipation structures. The cooling circuit may include a tank that has a volumetric center and that is capable of holding a maximum volume of fluid. Fluid enters the tank through a tank input and exits the tank through a tank output. The tank output has a port through which fluid from the tank enters the tank output. The tank is capable of being filled with a fluid volume that is less than the maximum volume of fluid, such that the port remains immersed in fluid irrespective of tank orientation.
1. A system for cooling at least one electronic component, the at least one electronic component in thermal contract with one or more heat dissipation structures, the cooling system comprising:
a cooling circuit having a fluid reservoir, the fluid reservoir including:
a tank capable of holding a maximum volume of fluid, the tank having a port through which fluid from the tank having a volumetric center;
a tank input through which fluid enters the tank; and
a tank output through which fluid exists the tank, the tank output having a port through which fluid from the tank enters the tank output, the tank capable of being filled with a fluid volume which is less than the maximum volume of fluid, such that the port remains immersed in fluid irrespective of tank orientation; and
at least one sliding seal mechanism coupled to the cooling circuit, the at least one sliding seal mechanism for coupling to at least one of the one or more heat dissipation structures.
2. The system according to claim 1 , wherein the cooling circuit includes one of the refrigeration circuit and a fluidic circuit.
3. The system according to claim 1 , wherein the one or more heat dissipation structures includes one of an evaporator and a cold plate.
4. The system according to claim 1 , wherein the at least one sliding seal mechanism includes:
a first duct coupled to the cooling circuit; and
a second duct coupled to the first duct via a sliding seal, the second duct for coupling to at least one of the one or more heat dissipation structures.
5. A cooling system comprising:
a surface;
at least one electronic component coupled to the surface;
one or more heat dissipation structures in thermal contact with at least one electronic component;
a cooling circuit including a fluid reservoir, the fluid reservoir including:
a tank capable of holding a maximum volume of fluid, the tank having a port through which fluid from the tank enters the tank output, the tank capable of being filled with a fluid volume which is less than the maximum volume of fluid, such that the port remains immersed in fluid irrespective of tank orientation;
at least one sliding seal mechanism coupled to the cooling circuit and the one or more heat dissipation structures so as to provide fluid communication between the cooling circuit and the one or more heat dissipation structures.
6. A cooling system comprising:
a surface;
at least one heat dissipation structures in thermal contact with the at least one electronic component;
a cooling circuit including a fluid reservoir, the fluid reservoir including:
a tank capable of holding a maximum volume of fluid, the tank having a volumetric center;
a tank input through which fluid enters the tank; and
a tank output through which fluid exits the tank, the tank output having a port through which fluid from the tank enters the tank output, the tank capable of being filled with a fluid volume which is less than the maximum volume of fluid, such that the port remains immersed in fluid irrespective of tank orientation; and
at least one flexible tube coupled to the cooling circuit and the one or more heat dissipation structures so as to provide fluid communication between the cooling circuit and the one or more heat dissipation structures.