Polishing apparatus, polishing method, control program for causing computer to execute polishing, and recording medium
View Patent ↗A polishing apparatus includes a table on which a polishing target member is placed, and at least one nozzle which sprays a polishing solution to a surface of the polishing target member so as to form, by polishing, the surface of the polishing target member. The nozzle and the polishing target member move relative to each other, and an angle of the nozzle is changeable.
1. A polishing apparatus comprising:
a table on which an optical target member is placed; and
at least one nozzle which forms and polishes a surface of the optical target member by spraying a polishing solution onto the surface of the optical target member,
wherein the nozzle and the optical target member are movable relative to each other, and
wherein an angle of the nozzle relative to the optical target member is changeable.
2. The polishing apparatus according to claim 1 , wherein the table is rotatable.
3. The polishing apparatus according to claim 1 , further comprising means for controlling a period of time during which the polishing solution is sprayed.
4. The polishing apparatus according to claim 1 , wherein the nozzle is detachably attached to an arm of the polishing apparatus.
5. The polishing apparatus according to claim 1 , wherein the nozzle is attached to the polishing apparatus such that a direction of the nozzle and a position of the nozzle in a rotational direction about an axis along a jetting direction of the polishing solution from the nozzle are made constant.
6. The polishing apparatus according to claim 1 , further comprising means for displaying shape data of the optical target member prior to a polishing operation and for recording and displaying a process condition preset based on the shape data.
7. A polishing apparatus comprising:
a table on which a polishing target member is placed;
at least one nozzle which sprays a polishing solution onto a surface of the polishing target member;
measuring means for measuring a shape of the polishing target member;
polishing amount setting means for setting a polishing amount of each portion of the polishing target member based on measurement data produced by the measuring means;
processing condition setting means for setting a processing condition according to quality of material of the polishing target member and polishing information; and
moving means for moving the nozzle and the polishing target relative to each other.
8. The polishing apparatus according to claim 7 , wherein the table is rotatable.
9. The polishing apparatus according to claim 7 , further comprising means for controlling a period of time during which the polishing solution is sprayed.
10. The polishing apparatus according to claim 7 , wherein the nozzle is detachably attached to an arm of the polishing apparatus and a spraying angle of the nozzle is variable.
11. The polishing apparatus according to claim 7 , wherein the nozzle is attached to the polishing apparatus such that a direction of the nozzle and a position of the nozzle in a rotational direction about an axis along a jetting direction of the polishing solution from the nozzle are made constant.