IP Library Granted Patent US 6,956,641
Granted Patent B2
US 6,956,641 · App. 10/317,156 · Granted Oct 18, 2005

Method of forming resist pattern, and exposure device

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Quick Facts
Patent No.
US 6,956,641
App. No.
10/317,156
Granted
Oct 18, 2005
Kind
B2
Abstract

A device for exposure of an object surface having a predetermined shrinkage rate during a baking process of the object. The device includes an optical system having a light source irradiating light towards a target location. A filter is provided between the target location and the light source. The filter has a transmission rate that is adjustable to at least three different levels and which passes light from the light source therethrough.

Claims (6)

1. A device for exposure of an object surface having a predetermined shrinkage rate during bake processing of the object following exposure, the device comprising:

(a) an optical system having a light source which when operated irradiates light of a substantially uniform intensity towards a target location, which location is placement of the object surface comprising a plurality of exposure unit regions thereat for exposure,

(b) a filter provided between the target location and the light source, the filter being divided into a plurality of unit areas each of which being smaller than the exposure unit regions and having a transmission rate per unit area adjustable to at least three different levels, the filter being passed light having an exposure amount corresponding to a predetermined shrinkage rate in the object surface based on bake processed following exposure of light irradiated from the light source therethrough.

2. The device of claim 1 , wherein the transmission rate of the filter is corrected for each predetermined region of the object surface for reducing a distribution of errors in the shrinkage rate, which distribution corresponds to a temperature distribution arising in the object during the bake process.

3. The device of claim 1 , wherein the transmission rate of the filter is corrected for each predetermined region of the object to be processed for reducing a distribution of errors in the shrinkage rate for forming a final pattern on the object surface.

4. The device of claim 1 , wherein a total area of the unit areas is larger than a total area of the exposure unit regions.

Assignments (1)
CHANGE OF NAME Recorded Mar 5, 2009
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 022399/0969 →