Feedthrough interconnection assembly
View Patent ↗The present invention relates to optimization of communication equipment with respect to size and undesired signal interference. To this aim a ceramic feedthrough interconnection assembly is proposed in order to transport an electrical information signal to and from a communication capsule. In addition to at least one signal lead ( 103 a, 103 b ) for communicating an electrical information signal, the assembly contains at least one auxiliary lead and a shield ( 103 c, 103 d, 104, 104 a, 104 b, 104 f ) that electrically shields the at least one signal lead ( 103 a, 103 b ) from the at least one auxiliary lead. The shield ( 103 c, 103 d, 104, 104 a, 104 b, 104 f ) has such dimensions (d 1 , d 2 ) and is positioned at such distance (d 3 , d 4 , d 12 ) from the at least one signal lead ( 103 a, 103 b ) that the electrical information signal experiences a well-defined and substantially constant impedance in the assembly. This in turn, minimizes the risk of undesired signal reflections. At the same time the assembly allows a high lead density, i.e. short distances between the leads.
1. A ceramic feedthrough interconnection assembly comprising:
A. a matrix having
a. a first section comprising an electrically insulating material having a first dielectric constant; and
b. a second section comprising an electrically insulating material having a second dielectric constant;
B. said matrix further comprising:
a. a first trans-matrix signal lead for communicating an electrical information signal such that said signal lead is exposed exclusively to said first electrically insulating material in said first section and to said second electrically insulating material in said second section; and
b. a trans-matrix auxiliary lead; and
C. a shield extending through said first and second sections and electrically shielding said signal lead from said auxiliary lead, said shield in said first and second sections is positioned at a distance from said signal lead with respect to the dielectric constant of any electrically insulating material such that the electrical information signal experiences a defined and substantially constant impedance.
2. The ceramic feedthrough interconnection assembly of claim 1 further comprising a second trans-matrix signal lead for communicating the electrical information signal on a differential signal format, said first and second signal leads being separated by a distance of electrically insulating material in each of said first and second sections, said distance being adapted with respect to the dielectric constant of the material present between said first and second signal leads.
3. The ceramic feedthrough interconnection assembly of claim 2 further comprising a design adapted to extend over a single face of a component capsule.
4. The ceramic feedthrough interconnection assembly of claim 2 in which said first signal lead comprises a stripline structure in said first section.
5. The ceramic feedthrough interconnection assembly of claim 4 in which said first signal lead comprises a microstrip structure in said second section.
6. The ceramic feedthrough interconnection assembly of claim 1 in which said shield comprises a lead for connection to an external ground potential.
7. The ceramic feedthrough interconnection assembly according to claim 6 in which said shield exclusively surrounds said first signal lead.
8. The ceramic feedthrough interconnection assembly according to claim 1 in which said electrically insulating material in said first section comprises a ceramic material, and said electrically insulating material in said second section comprises a non-ceramic electrically insulating material.
9. The ceramic feedthrough interconnection assembly of claim 8 in which said first signal lead comprises a stripline structure in said first section.
10. The ceramic feedthrough interconnection assembly of claim 8 further comprising a second trans-matrix signal lead.
11. A ceramic feedthrough interconnection assembly comprising:
A. a matrix having
a. a first section comprising a ceramic electrically insulating material having a first dielectric constant; and
b. a second section comprising a non-ceramic electrically insulating material having a second dielectric constant;
B. said matrix further comprising:
a. at least two trans-matrix signal leads for communicating an electrical information signal such that said signal leads are exposed exclusively to said first electrically insulating material in said first section and to said second electrically insulating material in said second section; and
b. a trans-matrix auxiliary lead; and
C. a shield extending through said first and second sections and electrically shielding said signal leads from said auxiliary lead, said shield in said first and second sections is of a size and shape so as to provide a defined and substantially constant impedance in said signal leads.
12. The ceramic feedthrough interconnection assembly of claim 11 further comprising a design adapted to extend over a single face of a component capsule.
13. The ceramic feedthrough interconnection assembly of claim 11 in which said first signal lead comprises a stripline structure in said first section.
14. The ceramic feedthrough interconnection assembly of claim 13 in which said shield comprises a lead for connection to an external ground potential.
15. The ceramic feedthrough interconnection assembly of claim 13 in which said first signal lead comprises a microstrip structure in said second section.
16. An optoelectrical capsule for converting information signals between an electrical signal format and an optical signal format, comprising a capsule having a feedthrough interconnection assembly comprising:
A. a matrix having
a. a first section comprising an electrically insulating material having a first dielectric constant; and
b. a second section comprising an electrically insulating material having a second dielectric constant;
B. said matrix further comprising:
a. a trans-matrix signal lead for communicating an electrical information signal such that said signal lead is exposed exclusively to said first electrically insulating material in said first section and to said second electrically insulating material in said second section; and
b. a trans-matrix auxiliary lead; and
C. a shield extending through said first and second sections and electrically shielding said signal lead from said auxiliary lead, said shield in said first and second sections is positioned at a distance from said signal lead with respect to the dielectric constant of any electrically insulating material such that the electrical information signal experiences, and is of a size and shape so as to provide, a defined and substantially constant impedance.
17. The optoelectrical capsule of claim 16 in which said electrically insulating material having a first dielectric constant comprising a ceramic material.
18. The optoelectrical capsule of claim 16 in which said electrically insulating material having a second dielectric constant comprising a non-ceramic material.
19. The optoelectrical capsule of claim 16 further comprising positioning said feedthrough interconnection assembly in a manner effective to permit said capsule to a circuit board footprint smaller than the largest side of said capsule.
20. An optoelectrical transceiver unit comprising a circuit board comprising the optoelectrical capsule according to claim 19 .